Allicdata Part #: | ATS16096-ND |
Manufacturer Part#: |
ATS-09D-91-C2-R0 |
Price: | $ 4.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X10MM R-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-09D-91-C2-R0 Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 3.62880 |
10 +: | $ 3.52800 |
25 +: | $ 3.33194 |
50 +: | $ 3.13589 |
100 +: | $ 2.93990 |
250 +: | $ 2.74390 |
500 +: | $ 2.54791 |
1000 +: | $ 2.49892 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 21.97°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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A Heat Sink is a device designed to disperse heat. Heat Sinks have become commonplace in computing and electronics applications, as thermal management has become an increasingly important consideration in electronic product design. The ATS-09D-91-C2-R0 Heat Sink is designed for use in a variety of applications.
Application
The ATS-09D-91-C2-R0 Heat Sink is suitable for a range of applications, including cooling of medium-power components, such as ICs, FPGAs, and CPU; cooling of small motors; and thermal management in lighting and automotive applications. It is a rugged, reliable, and cost-effective solution for applications where load control and reliable heat dissipation are needed.
Principle of Operation
Heat Sinks utilize the thermodynamic principle of heat transfer, which states that heat will automatically flow from a region of higher temperature to one of lower temperature. This flow of heat is conducted through the Heat Sink via the use of a coolant, typically air or some type of liquid. As the coolant passes through the Heat Sink, it absorbs the heat generated by the electronic component and carries it away.
Design
The ATS-09D-91-C2-R0 Heat Sink is designed to take advantage of the thermodynamic principle of heat transfer, and to provide superior cooling performance. The Heat Sink is designed with a series of fins which increase the surface area of the Heat Sink and create more efficient heat transfer pathways. The Heat Sink also features a highly efficient fan which helps to further improve its cooling performance by pulling in more air and circulating it through the fins.
Conclusion
The ATS-09D-91-C2-R0 Heat Sink is designed to provide outstanding thermal management performance in a variety of applications. By taking advantage of the thermodynamic principle of heat transfer and utilizing a highly efficient design, the Heat Sink is a reliable and cost-effective solution for cooling medium-power electronics in applications where load control and reliable heat dissipation are needed.
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