ATS-09D-91-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS16096-ND

Manufacturer Part#:

ATS-09D-91-C2-R0

Price: $ 4.00
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09D-91-C2-R0 datasheetATS-09D-91-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.62880
10 +: $ 3.52800
25 +: $ 3.33194
50 +: $ 3.13589
100 +: $ 2.93990
250 +: $ 2.74390
500 +: $ 2.54791
1000 +: $ 2.49892
Stock 1000Can Ship Immediately
$ 4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

A Heat Sink is a device designed to disperse heat. Heat Sinks have become commonplace in computing and electronics applications, as thermal management has become an increasingly important consideration in electronic product design. The ATS-09D-91-C2-R0 Heat Sink is designed for use in a variety of applications.

Application

The ATS-09D-91-C2-R0 Heat Sink is suitable for a range of applications, including cooling of medium-power components, such as ICs, FPGAs, and CPU; cooling of small motors; and thermal management in lighting and automotive applications. It is a rugged, reliable, and cost-effective solution for applications where load control and reliable heat dissipation are needed.

Principle of Operation

Heat Sinks utilize the thermodynamic principle of heat transfer, which states that heat will automatically flow from a region of higher temperature to one of lower temperature. This flow of heat is conducted through the Heat Sink via the use of a coolant, typically air or some type of liquid. As the coolant passes through the Heat Sink, it absorbs the heat generated by the electronic component and carries it away.

Design

The ATS-09D-91-C2-R0 Heat Sink is designed to take advantage of the thermodynamic principle of heat transfer, and to provide superior cooling performance. The Heat Sink is designed with a series of fins which increase the surface area of the Heat Sink and create more efficient heat transfer pathways. The Heat Sink also features a highly efficient fan which helps to further improve its cooling performance by pulling in more air and circulating it through the fins.

Conclusion

The ATS-09D-91-C2-R0 Heat Sink is designed to provide outstanding thermal management performance in a variety of applications. By taking advantage of the thermodynamic principle of heat transfer and utilizing a highly efficient design, the Heat Sink is a reliable and cost-effective solution for cooling medium-power electronics in applications where load control and reliable heat dissipation are needed.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics