| Allicdata Part #: | ATS-02H-73-C3-R0-ND |
| Manufacturer Part#: |
ATS-02H-73-C3-R0 |
| Price: | $ 3.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-02H-73-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.01959 |
| 30 +: | $ 2.93790 |
| 50 +: | $ 2.77477 |
| 100 +: | $ 2.61154 |
| 250 +: | $ 2.44831 |
| 500 +: | $ 2.36669 |
| 1000 +: | $ 2.12187 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 29.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential to the success of a wide variety of products. It is important to find ways to make these solutions more efficient in order to increase the life of the products. One such product that has seen success recently are ATS-02H-73-C3-R0 thermal heat sinks. These thermal heat sinks are designed specifically to optimize thermal performance while maintaining a lightweight and compact design.
The ATS-02H-73-C3-R0 is an advanced heat treatment solution that combines the thermal performance of a heat sink with the lightweight and compact design of a co-extruded aluminium fin structure. The structure features integrated fins that improve the overall thermal management of a system. The aluminium fin structure allows for maximum cooling efficiency while minimizing its overall weight and footprint.
The ATS-02H-73-C3-R0 is an ideal solution for applications that require high thermal performance while maintaining a lightweight and low-profile structure. The overall design of the solution ensures that the thermal performance of the device is maximized while the footprint of the solution is minimized. This makes it possible to create more efficient systems that can be used in a variety of applications.
The ATS-02H-73-C3-R0 is also designed to work in conjunction with other heat sinks and cooling solutions. Its advanced cooling technology ensures that the thermal performance of the device is maximized while helping to reduce the overall operating temperature of the system. This makes it an ideal solution for applications that require high thermal performance and maximum operating temperatures.
The ATS-02H-73-C3-R0 is also designed with a unique mounting system that allows for easy installation. The structure of the solution can be mounted using standard hardware and it can easily be connected to existing heat sinks or cooling solutions without requiring additional parts or tools. This makes it an ideal solution for applications where space is limited and installation needs to be performed quickly and easily.
The ATS-02H-73-C3-R0 is an advanced thermal management solution that is designed to provide maximum cooling efficiency with minimal installation and maintenance costs. Its lightweight and low-profile design allows for maximum thermal performance while helping to reduce energy consumption. This makes it an ideal solution for applications that require high thermal performance and maximum operating temperatures. It is a reliable and cost-effective solution for thermal management applications that need to provide reliable and high performance results.
The specific data is subject to PDF, and the above content is for reference