ATS-07D-53-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-07D-53-C3-R0-ND

Manufacturer Part#:

ATS-07D-53-C3-R0

Price: $ 4.00
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X30MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-07D-53-C3-R0 datasheetATS-07D-53-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.63195
30 +: $ 3.43014
50 +: $ 3.22837
100 +: $ 3.02665
250 +: $ 2.82487
500 +: $ 2.62310
1000 +: $ 2.57265
Stock 1000Can Ship Immediately
$ 4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.76°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management within electronic and industrial systems is critical to the successful operation and longevity of these systems. Heat exchangers (also known as heat sinks) are used to move energy in the form of heat away from components and dissipate it in the environment. The use of a heat sink, also known as a heat exchanger, can improve overall system performance while saving power and reducing the risk of overheating. The ATS-07D-53-C3-R0 is a complete thermal heat sink designed for applications in all types of high-power machinery, from industrial equipment to military and aerospace systems.

The ATS-07D-53-C3-R0 heat sink is designed using a unique heat transfer design and a patented “cold plate” thermal plate design, capable of dissipating heat from components efficiently and quickly. It uses a combination of material science, airflow dynamics, and surface finish design to improve overall system performance, allowing for higher power output, reduced noise, and increased thermal efficiency. This heat sink’s structural design is comprised of a bottom plate made from copper, an aluminum extruded fin array, and a top plate made from aluminum.

The ATS-07D-53-C3-R0 thermal heat sink is used in a variety of applications due to its efficient performance. Industrial Electronics, telecommunications, Terrestrial, and Automotive industries are now widely utilising this product. The product works by transferring thermal energy away from core components via conduction through the use of the copper base and aluminium top and fin array. The base has a large surface area which ensures good contact between the components and the heat sink. In addition, the top and fin array also provide more space for heat to be dissipated, resulting in higher thermal efficiencies.

The working principle of the ATS-07D-53-C3-R0 thermal heat sink is based on natural convection – the idea is that hot air rises as it is replaced by cooler air, creating a convection current in the sink. The heat generated by the components rises and is cooled by the fins of the sink. This passive cooling method is known as natural convection, and it is extremely efficient in the use of power. The fins of the sink also aid in providing more surface area for greater heat dissipation.

In summary, the ATS-07D-53-C3-R0 thermal heat sink is an effective product that provides reliable heat dissipation capabilities. It works by transferring thermal energy away from core components via conduction, and dissipates the heat into the environment via natural convection. This product is ideal for use in industrial, telecommunications, terrestrial, and automotive applications, and is highly recommended for such applications due to its efficient performance and thermal efficiency.

The specific data is subject to PDF, and the above content is for reference

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