ATS-18D-128-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18D-128-C3-R0-ND

Manufacturer Part#:

ATS-18D-128-C3-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18D-128-C3-R0 datasheetATS-18D-128-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.89781
30 +: $ 3.68151
50 +: $ 3.46487
100 +: $ 3.24834
250 +: $ 3.03178
500 +: $ 2.81523
1000 +: $ 2.76109
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.98°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Introduction

An ATS-18D-128-C3-R0 is a thermal heat sink commonly used in electronic cooling applications. It is a barrel type heat sink that utilizes a single V-shaped fin configuration to maximize surface area without adding weight. The design increases the amount of air flow over the entire surface area of the heat sink, allowing for superior cooling capability and increased thermal efficiencies.

Design and Construction

The ATS-18D-128-C3-R0 heat sink is composed of extruded aluminum bar stock. The aluminum bar stock has been machined to a special V profile that maximizes the surface area of the heat sink. The heat sink is then anodized for a corrosion-resistant finish.The heat sink also includes a mounting system for attaching it to circuit boards or other components. The mounting system consists of either two screws for solid-state components, or one nut for spade type components.

Application Field and Working Principle

The ATS-18D-128-C3-R0 thermal heat sink is used primarily in applications where heat dissipation is a key factor. It is commonly used in electronics such as power supplies, audio amplifiers, computers, and high-end gaming systems.The heat sink works by increasing the surface area available for the transfer of heat. The larger the area available, the more efficiently heat can be dissipated away from the component, cooling the device.The heat sink also ensures that the heat is dispersed over as large of an area as possible. This helps to maximize the transfer of heat away from the component without creating hot spots, which could potentially cause damage.

Conclusion

The ATS-18D-128-C3-R0 thermal heat sink is a versatile and effective cooling solution for a variety of applications. It maximizes the available surface area for heat dissipation, allowing for an efficient and consistent cooling of components. The heat sink also benefits from an anodized finish to prevent against corrosion, making it a durable and reliable cooling solution.

The specific data is subject to PDF, and the above content is for reference

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