| Allicdata Part #: | 670-1719-ND |
| Manufacturer Part#: |
FI-S5P-HFE |
| Price: | $ 1.53 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | JAE Electronics |
| Short Description: | CONN RCPT 1.25MM 5POS SMD R/A |
| More Detail: | Connector Header Surface Mount, Right Angle 5 posi... |
| DataSheet: |  FI-S5P-HFE Datasheet/PDF |
| Quantity: | 214 |
| 1 +: | $ 1.39230 |
| 10 +: | $ 1.26567 |
| 100 +: | $ 1.08486 |
| 500 +: | $ 0.90405 |
| 1000 +: | $ 0.77490 |
| 5000 +: | $ 0.68708 |
| Series: | FI |
| Packaging: | Cut Strip |
| Part Status: | Active |
| Connector Type: | Receptacle |
| Contact Type: | Male Pin |
| Pitch - Mating: | 0.049" (1.25mm) |
| Number of Positions: | 5 |
| Number of Rows: | 1 |
| Row Spacing - Mating: | -- |
| Number of Positions Loaded: | All |
| Style: | Board to Cable/Wire |
| Shrouding: | Shrouded - 4 Wall |
| Mounting Type: | Surface Mount, Right Angle |
| Termination: | Solder |
| Fastening Type: | Friction Lock |
| Contact Length - Mating: | -- |
| Contact Length - Post: | -- |
| Overall Contact Length: | -- |
| Insulation Height: | 0.071" (1.80mm) |
| Contact Shape: | Square |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | -- |
| Contact Finish - Post: | Tin or Tin-Alloy |
| Contact Material: | Copper Alloy |
| Insulation Material: | Liquid Crystal Polymer (LCP), Glass Filled |
| Features: | Solder Retention |
| Operating Temperature: | -40°C ~ 80°C |
| Ingress Protection: | -- |
| Material Flammability Rating: | UL94 V-0 |
| Insulation Color: | Beige |
| Current Rating: | 1A per Contact |
| Voltage Rating: | 200V |
| Mated Stacking Heights: | -- |
| Contact Finish Thickness - Post: | -- |
| Applications: | -- |
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.The FI-S5P-HFE Series are rectangular connectors that are mainly used for board-to-board connection in a wide array of applications. They provide a robust, secure connection and are designed for high-speed data transmission. The FI-S5P-HFE is a 2–row, vertical straight-type, double-row receptacle type connector. This makes it ideal for wire-to-wire and wire-to-board applications in a variety of industries, from home automation to industrial automation and network solutions.
The FI-S5P-HFE features two parallel rows of terminals with a 2.00mm pitch for contact spacing. It is also compatible with 2.54mm and 3.96mm pitch terminals. This connector features high-speed mating of signal lines with gold-plated contacts and a secure lock with its two-point latch design, ensuring fast and reliable connections. It also features the innovative HF-TAM (High Flex–Tin–Antimony–Molybdenum) contact surface treatment, which increases the contact stability and provides an excellent high-speed data transmission.
The FI-S5P-HFE can be used in a variety of applications in industries such as automotive, broadcast, consumer electronics and home automation. It is ideal for use in data and power transmission in powertrains, cameras, media players, automation systems, robots, industrial equipment and many more. With its high-speed data transmission, secure locking mechanism and wide variety of applications, the FI-S5P-HFE is a great choice for making secure and reliable connections in the industrial, commercial and home applications.
The working principle of the FI-S5P-HFE connector is simple. It consists of two rows of terminals with gold-plated contacts which are combined with two-point latch design. The two-point latch design provides secure locking and prevents unnecessary disconnection. The high-speed mating of signal lines is ensured by the HF-TAM contact surface treatment. This ensures a fast and reliable connection and high-speed data transmission.
In conclusion, the FI-S5P-HFE Series is a reliable and robust connector for many applications. It provides high-speed mating of signal lines, a secure locking mechanism and a wide variety of applications. It is ideal for use in a range of applications, from home automation to industrial automation. This connector is a great choice for making secure and reliable connections in the industrial, commercial, and home applications.
The specific data is subject to PDF, and the above content is for reference
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