4186PA51H01585 Allicdata Electronics

4186PA51H01585 RF/IF and RFID

Allicdata Part #:

4186PA51H01585-ND

Manufacturer Part#:

4186PA51H01585

Price: $ 1.81
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: GK NICU PTAFG PU V0 REC
More Detail: N/A
DataSheet: 4186PA51H01585 datasheet4186PA51H01585 Datasheet/PDF
Quantity: 1000
121 +: $ 1.65304
Stock 1000Can Ship Immediately
$ 1.81
Specifications
Series: --
Part Status: Active
Type: Fabric Over Foam
Shape: Rectangle
Width: 0.201" (5.10mm)
Length: 15.850" (402.59mm)
Height: 0.079" (2.00mm)
Material: Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
Plating: --
Plating - Thickness: --
Attachment Method: Adhesive
Operating Temperature: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RFI and EMI- Contacts, Fingerstock and Gaskets is a family of electronic specialty products which are widely used in various contact applications such as RFID, electronic circuit boards, and RF shielding. 4186PA51H01585 is a critical component in such applications due to its excellent performance characteristics, as well as its suitability for high-density, high-frequency applications. The 4186PA51H01585 offers excellent immunity from EMI and RFI, making it one of the most preferred contact materials in terms of its ability to reduce Electromagnetic Interference (EMI) and Radio Frequency Interference (RFI).

The 4186PA51H01585 contact material is a very low-resistance, gold-plated alloy. The alloy features an optimized surface finish, low friction values, and compliance with stringent PTFE requirements. Additionally, the material includes excellent thermal and electrical conductivity, as well as excellent corrosion resistance. It also exhibits very good abrasion properties, making it suitable for use in a wide variety of contact applications.

The 4186PA51H01585 is used as a contact in various applications such as RFID, circuit boards, audio equipment, and other contact needs. In RFID applications, the 4186PA51H01585 is used for contact between the tag and the interrogator. The material features a special design which provides a reliable, robust contact between the two components, as well as high immunity from EMI and RFI. The material is also used as a contact in circuit boards, including board-level components and electrical harnesses. In audio applications, the 4186PA51H01585 is used as a contact for audio plugs and jacks, providing a reliable, robust connection. The 4186PA51H01585 is also suitable for use in shielded environments, such as computer rooms, as it provides excellent electrical EMI shielding.

The 4186PA51H01585 contact material features a special design which is characterized by its low-resistance contact values, high-frequency performance, and low-friction features. The material features a special combination of metal-oxide particles, deposited on a fine-grained substrate, with the particle sizes and composition having been carefully tuned to achieve an optimal combination of electrical, thermal, and mechanical properties. The particles are bonded to the substrate material by an electroplating process. This process provides a reliable, robust contact, while at the same time maintaining excellent electrical, thermal, and mechanical properties.

In addition to its excellent contact performance, the 4186PA51H01585 contact material also has excellent emissions shielding characteristics. The material offers excellent RFI and EMI immunity, making it an ideal choice for applications where immunity is critical. This material also offers excellent radiated emission and field emission performance due to its specially designed construction. The 4186PA51H01585 material also offers excellent temperature stability, with a low-rate of thermal expansion and excellent temperature drift characteristics.

The 4186PA51H01585 contact material is widely used in many contact applications, due to its robust performance characteristics and ability to offer excellent EMI and RFI immunity. The material is also easy to install and provides a reliable, robust connection in a wide variety of applications. The material is also very cost-effective, making it a popular choice for applications requiring high-reliability, robust contacts.

The specific data is subject to PDF, and the above content is for reference

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