BR24G32FVM-3GTTR Allicdata Electronics
Allicdata Part #:

BR24G32FVM-3GTTR-ND

Manufacturer Part#:

BR24G32FVM-3GTTR

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: ROHM Semiconductor
Short Description: IC EEPROM 32K I2C 400KHZ 8MSOP
More Detail: EEPROM Memory IC 32Kb (4K x 8) I²C 400kHz 8-MSOP
DataSheet: BR24G32FVM-3GTTR datasheetBR24G32FVM-3GTTR Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: --
Packaging: Tape & Reel (TR) 
Part Status: Active
Memory Type: Non-Volatile
Memory Format: EEPROM
Technology: EEPROM
Memory Size: 32Kb (4K x 8)
Clock Frequency: 400kHz
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Voltage - Supply: 1.6 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-VSSOP, 8-MSOP (0.110", 2.80mm Width)
Supplier Device Package: 8-MSOP
Base Part Number: BR24G32
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The BR24G32FVM-3GTTR is a DDR2 memory module designed for use in embedded applications. It has a maximum speed of 800MHz and a capacity of 4GB. It is a double-data-rate (DDR) memory module, meaning it transfers data twice per clock cycle, resulting in higher data transfer speeds than single-data-rate (SDR) memory modules. The module also features Error Correction Code (ECC) support to help detect and correct errors in data transfer. The BR24G32FVM-3GTTR is ideal for applications such as industrial automation, networking, and gaming, where data accuracy and speed are paramount.

The BR24G32FVM-3GTTR includes a feature called On-Die Termination (ODT) to help signal integrity. ODT reduces signal reflection and dampens ringing by matching the output impedance between signal connections. This helps reduce EMI and reduces power consumption. The module also features higher signal-to-noise ratios, resulting in improved performance and faster data transfer.

The BR24G32FVM-3GTTR supports both DDR3 and DDR4 SDRAM. DDR3 SDRAM is backward compatible with DDR2, but offers improved performance. DDR4 SDRAM has twice the capacity and twice the speed of DDR3 SDRAM, making it well suited for applications requiring high bandwidth and speed. The BR24G32FVM-3GTTR is designed to provide an easy upgrade path for systems requiring DDR2 memory when upgrading to DDR3 or DDR4.

The BR24G32FVM-3GTTR has a robust design, making it well-suited for reliable operation in high-temperature and high-humidity conditions. The design has been tested to meet the RoHS and UL safety standards, as well as suitable for use in MIL-STD compliant applications. The module includes thermal sensors that monitor operating temperature and provide signal thresholds for thermal alarms. This allows for system shutdown before temperatures become too high.

The BR24G32FVM-3GTTR features the latest DRAM technology, allowing for energy-efficient operation with low power consumption and low heat dissipation. The design has improved refresh algorithms, helping further reduce power consumption by reducing the frequency of refreshes. The module includes an advanced signal isolation technique that further reduces power consumption.

In conclusion, the BR24G32FVM-3GTTR is a reliable and powerful memory module designed for use in embedded applications. The module provides a cost-effective upgrade path for adding DDR2, DDR3 or DDR4 memory. The module supports high-speed data transfer and error correction, while also featuring a robust design suitable for MIL-STD compliant applications. The module also includes advanced power-management features and thermal sensors, making it an ideal choice for applications where performance and reliability are paramount.

The specific data is subject to PDF, and the above content is for reference

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