DM74ALS245AWMX

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DM74ALS245AWMX is a logic-level device which belongs to the family of Buffers, Drivers, Receivers, Transceivers group. As an octal bus transceiver, it has the ability to quickly pass in and out data from the system bus. It is manufactured by Fairchild Semiconductor, with properties that includes a 900 ns maximum propagation delay, a 2.7 V to 5.5 V supply voltage, and a -40 °C to 85 °C operating temperature range.

Utilizing its low-power dissipated feature, the DM74ALS245AWMX helps save energy and simplify its system’s power requirements. It features open-drain outputs that are capable of sinking 64 mA of current and a variable bus hold for both A and B buses.

The main application fields of the DM74ALS245AWMX are mostly comprised of TTL-signal system’s data transmission, as it is able to support both full-duplex and half-duplex communication flows. Moreover, it provides communications of 8-bit data with a single transceiver direction enabling.

Its working principle is relatively simple and it starts by placing the device in the system bus. The A bus that is connected to Port A and the B bus is connected to Port B. The Port A, with its tri-state buffer and direction control logic, is used to transmit data while the B port is used to receive it, with its tri-state buffer, direction control logic and 3-state control logic.

Once the DM74ALS245AWMX is enabled, the data from A port will be transferred to B port in a bidirectional-mode or selected in a single state direction using the OE and DIR control inputs. The data is then transferred over the system bus until it reaches its final destination.

With its ability to operate in full-duplex or half-duplex data communication mode, fast A and B bus switching and access to 15ns access times, the DM74ALS245AWMX makes for a great candidate for any intermediate-level system’s data transmission requirements. In conclusion, the DM74ALS245AWMX makes an excellent choice of buffer, driver, receiver, and transceiver for any TTL-signal system due to its versatility and encapsulation feature.

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