A3P1000-1FGG256M Allicdata Electronics
Allicdata Part #:

A3P1000-1FGG256M-ND

Manufacturer Part#:

A3P1000-1FGG256M

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 177 I/O 256FBGA
More Detail: N/A
DataSheet: A3P1000-1FGG256M datasheetA3P1000-1FGG256M Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: ProASIC3
Part Status: Active
Total RAM Bits: 147456
Number of I/O: 177
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)
Description

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Embedded computing technology has been widely used in industry and military for many years. With the development of microelectronics technology,Field Programmable Gate Array (FPGAs) technology provides a flexible and cost-effective approach for implementation of digital systems. A3P1000-1FGG256M is one of popular FPGA technology which is widely used for its features including high performance, low power consumption, small form factor and embedded hardware support.

A3P1000-1FGG256M is an FPGA fromAltera Corporation, a leader in programmable technology solutions. It is a low cost, high performance device that is designed to meet the requirements of a variety of embedded applications. The A3P1000-1FGG256M is a full featured device that offers 256 megabits of programmable logic capacity, over 330Kbits of RAM, and 8Mbits of external memory. It is suitable for a wide range of embedded applications such as industrial control systems, communications systems, automotive systems, image processing and medical equipment.

The A3P1000-1FGG256M FPGA is based on structured logic technology, which divides the logic functions into cells that are configured to match the required logic functions. This allows the main logic components (e.g., combinatorial/sequential logic elements, RAM, ROM, etc.) to be placed in the same circuit with no external connections or glue logic required. This makes the device well suited for embedded applications as well as providing a smaller and lower power solution.

The A3P1000-1FGG256M supports a variety of I/O standards including LVTTL, LVCMOS, and dedicated high-speed I/O protocol standards such as DDR3 and PCIe. Additionally, the device includes rich IP cores such as Ethernet MAC, PCIe root port, etc., to accelerate the development of embedded applications. In addition, A3P1000-1FGG256M features PowerPlay power management technology which enables lower power consumption in applications with dynamic power requirements.

The A3P1000-1FGG256M also features built-in system enhancements such as Flash configuration device and JTAG debugging module for easy system implementation and debugging. Furthermore, the device includes a Quartus transceiver design suite to facilitate the automation of transceiver-based designs. The validation and reduction of design cycle times are also further enhanced through its advanced computer-aided design tools that provide advanced verification and analysis capabilities.

The A3P1000-1FGG256M FPGA offers the flexibility, performance and cost-effectiveness to be a popular choice for embedded applications. The device has all the essential features required to design and implement a wide range of embedded systems. In addition, its advanced IP cores, support for various I/O standards, and power management capabilities ensure that complex and power-sensitive applications can be designed with ease.

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