Allicdata Part #: | AE10915-ND |
Manufacturer Part#: |
V5816 |
Price: | $ 0.07 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ALUM ANOD |
More Detail: | Heat Sink Aluminum Top Mount |
DataSheet: | V5816 Datasheet/PDF |
Quantity: | 5800 |
1 +: | $ 0.06300 |
10 +: | $ 0.03528 |
25 +: | $ 0.03352 |
50 +: | $ 0.03263 |
100 +: | $ 0.03219 |
250 +: | $ 0.02999 |
500 +: | $ 0.02822 |
1000 +: | $ 0.02558 |
5000 +: | $ 0.02470 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | -- |
Attachment Method: | Press Fit |
Shape: | Cylindrical |
Length: | -- |
Width: | -- |
Diameter: | 0.122" (3.10mm) ID, 0.295" (7.50mm) OD |
Height Off Base (Height of Fin): | 0.157" (4.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal- Heat Sinks are devices which are designed to dissipate thermal energy from electronic components. Generally, a heat sink is made up of a single material that is either conducted or transferred through, or is simply placed over a component, such as an integrated circuit, so as to cool it. Heat sinks are very effective in dissipating the heat away from its source. Therefore, when used in electronics, they can help reduce the operating temperature of the components.
The V5816 is a type of heat sink used in thermal management. It is made of a single aluminum material which is specially designed to dissipate heat away from electronic components. The V5816 consists of a base plate, a heat sink with snap-on mounting brackets, and screws for mounting the heat sink to the component being cooled. The base plate is designed to provide a good thermal transfer between the heat sink and the component. The snap-on brackets allow the heat sink to be quickly and securely attached to the component, while the screws ensure a secure fit.
The V5816 is typically used in applications requiring high thermal performance, such as for cooling power supply electronics, lasers and other specialized electronics. It provides excellent thermal efficiency in relatively short wavelength thermal applications. This heat sink has a low thermal resistance which allows for more efficient heat transfer. Additionally, the V5816 can be placed in close proximity to the component to be cooled and the heat it dissipates is dissipated evenly across all the surfaces of the component. This allows for better heat transfer than other types of heat sinks.
The V5816 also features a wide operating range and is well suited for both static and dynamic thermal applications. It is low in weight, yet is able to dissipate large amounts of thermal energy. Furthermore, this heat sink is corrosion resistant, making it suitable for use in harsh environments. The V5816 also includes a number of components which enable it to be easily and quickly mounted onto the component being cooled.
The working principle of the V5816 is simple. Heat is generated from the component being cooled and is then transferred to the heat sink via conduction. The heat sink dissipates the heat away from the component and into its surroundings. The heat sink also includes a fan which helps to further dissipate the heat away from the component. As the heat dissipates, the component is cooled and the temperature of the surrounding environment is lowered.
In conclusion, the V5816 is an effective and efficient heat sink for cooling electronic components. Its single aluminum material, snap-on mounting brackets, and included fan make it a great option for applications requiring high thermal performance. Furthermore, its low thermal resistance and wide operating range make it an ideal choice for both static and dynamic thermal applications as well as for use in harsh environments. The V5816’s working principle is simple and effective. Through conduction, the V5816 is able to transfer heat away from the component being cooled and dissipate it into the surrounding environment.
The specific data is subject to PDF, and the above content is for reference
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