271-AB Allicdata Electronics
Allicdata Part #:

345-1042-ND

Manufacturer Part#:

271-AB

Price: $ 0.25
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK TO-220 TOP MNT BLK
More Detail: Heat Sink TO-220 Aluminum 4.0W @ 62°C Board Level
DataSheet: 271-AB datasheet271-AB Datasheet/PDF
Quantity: 3572
1 +: $ 0.22680
10 +: $ 0.21609
25 +: $ 0.20563
50 +: $ 0.20009
100 +: $ 0.19744
250 +: $ 0.18388
500 +: $ 0.17307
1000 +: $ 0.15685
5000 +: $ 0.15144
Stock 3572Can Ship Immediately
$ 0.25
Specifications
Series: 271
Part Status: Active
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 0.700" (17.78mm)
Width: 1.750" (44.45mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 4.0W @ 62°C
Thermal Resistance @ Forced Air Flow: 5.10°C/W @ 400 LFM
Thermal Resistance @ Natural: 15.50°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a key consideration in the operation of electronic components, particularly in high temperature environments, and a wide variety of solutions are available. The 271-AB thermal solution is an advanced thermal field solution, offering improved performance, better thermal control, and higher efficiency than traditional solutions. In this article, we will explore the 271-AB application field and working principle.

Application Field

The 271-AB thermal solution is used to cool a variety of components and devices, including CPUs, GPUs, memory modules, and power units. It is particularly well suited for high temperature and high power electronic components, such as CPUs, which require a high degree of thermal control to remain operational. The 271-AB solution can also be used in situations where traditional cooling solutions are inadequate, such as high-power components that are running in environments with a high ambient temperature.

Working Principle

The 271-AB solution consists of two main components – the heat sink and the fan. The heat sink is responsible for dissipating heat from the components it is cooling, while the fan is used to circulate air around the components, providing cooling and ventilation. The heat sink is typically constructed from a heat conducting material, such as copper or aluminum, and is designed to maximize surface area. The fan is also designed to maximize air flow, moving air across the surface of the heat sink and out of the system.

The fan is connected to the motherboard via a fan header, which is responsible for controlling the speed of the fan. The fan header can be adjusted to reduce or increase the speed of the fan, depending on the thermal load of the system. By increasing the fan speed, the system can be cooled more effectively, while reducing the fan speed can help to reduce noise and conserve energy.

The 271-AB solution is also designed to be user friendly, offering an easy to use interface for controlling the thermal field. The interface allows users to adjust fan speed, airflow direction, and temperature thresholds, allowing for quick and easy adjustment of the system’s thermal performance. The interface also offers access to real-time temperature monitoring, enabling users to quickly identify and address any issues with the system’s thermal performance.

Conclusion

The 271-AB thermal solution is an advanced thermal field solution, offering improved performance, better thermal control, and higher efficiency than traditional solutions. It is an ideal solution for high-temperature and high-power electronic components, as well as any situation where traditional cooling solutions are inadequate. The easy to use interface offers access to real-time temperature monitoring, enabling users to quickly identify and address any issues with the system’s thermal performance.

The specific data is subject to PDF, and the above content is for reference

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