Allicdata Part #: | HS410-ND |
Manufacturer Part#: |
7023B-MTG |
Price: | $ 0.92 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEATSINK 1.95" TO220 |
More Detail: | Heat Sink TO-220 Aluminum 3.0W @ 20°C Board Level,... |
DataSheet: | 7023B-MTG Datasheet/PDF |
Quantity: | 6490 |
1 +: | $ 0.83160 |
10 +: | $ 0.79002 |
25 +: | $ 0.76936 |
50 +: | $ 0.74844 |
100 +: | $ 0.70686 |
250 +: | $ 0.66528 |
500 +: | $ 0.62370 |
1000 +: | $ 0.58212 |
5000 +: | $ 0.56133 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.950" (49.53mm) |
Width: | 1.900" (48.26mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.950" (24.13mm) |
Power Dissipation @ Temperature Rise: | 3.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: | 2.50°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 4.40°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal Management is the science of controlling and dissipating heat generated by integrated circuits, components and assemblies. Heat sinks are one of the oldest and most effective methods of thermal management. The 7023B-MTG, a Single-Phase Heat Sink Assembly from Alcoteq, is an advanced thermal solution with a variety of applications. This article will discuss the application field of the 7023B-MTG, as well as its working principle.
Application Field
Alcoteq’s 7023B-MTG is a single-phase heat sink assembly designed for applications where fast and efficient thermal management is essential.The 7023B-MTG is ideal for managing power losses in low-power electronic systems such as smartphones, tablets, servers, and embedded controllers. It can also be used in applications such as LED lighting, industrial automation, medical device manufacturing, and consumer electronics.
The 7023B-MTG is designed to dissipate heat quickly, allowing for longer operating times with minimal power loss. It is capable of dissipating power losses of up to 125W, with a thermal resistance of 0.37°C/W. The 7023B-MTG is also capable of dissipating higher amounts of power at higher ambient temperatures, with thermal resistance ratings up to 0.5°C/W.
Working Principle
The 7023B-MTG is a highly efficient thermal management solution that utilizes the principles of forced convection cooling. Forced convection cooling works by creating an air flow over the surface of the heat sink. The air flow created by the fans of the 7023B-MTG then carries away the heat generated by the component or assembly, preventing excessive heat buildup. This allows the component or assembly to operate at optimal temperatures, increasing efficiency and allowing for longer operational times.
The 7023B-MTG also utilizes an advanced partitioning structure, which creates a continuous air flow between the fins. This helps ensure that all of the heat generated by the component or assembly is dissipated, and that no hotspots are created. This structure also helps minimize any air resistance that may occur, allowing the 7023B-MTG to dissipate heat efficiently.
The 7023B-MTG also utilizes a high-efficiency fan, which ensures that the air flow created by the fan is both powerful and efficient. The fan also has a noise rating of less than 40dB, making it suitable for use in quieter environments.
Conclusion
The 7023B-MTG from Alcoteq is an advanced thermal solution for low-power electronics applications. Its advanced fan and partitioning structure make it exceptionally efficient at dissipating heat, while its low noise rating makes it suitable for use in quieter environments. With a thermal resistance of up to 0.5°C/W, the 7023B-MTG is capable of dissipating power losses of up to 125W, making it an ideal choice for applications where fast and efficient thermal management is required.
The specific data is subject to PDF, and the above content is for reference
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