SP8K4TB Allicdata Electronics

SP8K4TB Discrete Semiconductor Products

Allicdata Part #:

SP8K4TBCT-ND

Manufacturer Part#:

SP8K4TB

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: ROHM Semiconductor
Short Description: MOSFET 2N-CH 30V 9A 8-SOIC
More Detail: Mosfet Array 2 N-Channel (Dual) 30V 9A 2W Surface ...
DataSheet: SP8K4TB datasheetSP8K4TB Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: --
Packaging: Cut Tape (CT) 
Part Status: Discontinued at Digi-Key
FET Type: 2 N-Channel (Dual)
FET Feature: Logic Level Gate
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 9A
Rds On (Max) @ Id, Vgs: 17 mOhm @ 9A, 10V
Vgs(th) (Max) @ Id: 2.5V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 21nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 1190pF @ 10V
Power - Max: 2W
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOP
Base Part Number: *K4
Description

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Field-effect transistors (FETs) are widely used in electronic and electrical equipment, and many types of FETs are developed in order to meet the special needs of various applications. SP8K4TB, or Silicon Drive-FET Array, is one of these special new FETs developed specifically to meet the stringent requirements of high current and voltage applications. As a high-current, high-voltage FET, SP8K4TB has been gaining popularity in many industrial and consumer applications, and has been widely used in such applications as power supplies, automotive switching and conversion, robotics, industrial control, and instrumentation.

SP8K4TB is a monolithic integrated circuit (IC) that includes a number of parallel FETs connected into an array. This array of FETs is able to draw a considerable amount of current and has the capability to withstand a large amount of voltage. Moreover, the array of FETs allows for very efficient power conversion and can easily handle high frequencies and complex waveforms. The FET array is designed in such a way that it can handle both AC and DC voltages with minimal loss and maintains excellent performance efficiency even at high frequencies.

The SP8K4TB FET array is constructed from silicon-germanium (SiGe) based substrate material, which is designed to provide a much higher current density than traditional silicon substrate materials. This is because the SiGe substrate material is more conductive and is able to carry more electrons in comparison to traditional silicon substrates. The resulting FET array is able to dissipate heat quickly and has minimal power losses, making it highly efficient and reliable.

The SP8K4TB array is optimized for high frequency switching applications and features a large number of FETs that have low dynamic on-state resistance (rDSon). This low rDSon gives the SP8K4TB FET array the capability to perform high frequency switching applications with minimal losses in total efficiency. Additionally, the FET array can also be used in voltage-controlled applications without needing additional transistors.

Other features of the SP8K4TB FET array include its fast response time, low inductance and low capacitance, which make the FET array highly suitable for high-speed switching applications. In addition, the FET array is also designed to be tolerant to thermal shocks and transient overloads. This high tolerance to thermal overloads ensures that the FET array will be reliable and able to withstand high voltages and currents without being damaged.

In summary, the SP8K4TB FET array is a highly efficient, reliable and versatile FET that is designed for demanding applications, such as power supplies, automotive switching and conversion, robotics and industrial control. Its construction from SiGe based substrate material allows it to dissipate heat quickly and efficiently, while its array of FETs enables it to operate at high frequencies and voltages without significant losses. The FET array features excellent response time, low inductance and low capacitance, and is able to withstand thermal overloads without being damaged.

The specific data is subject to PDF, and the above content is for reference

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