530614B00000G Allicdata Electronics
Allicdata Part #:

HS278-ND

Manufacturer Part#:

530614B00000G

Price: $ 0.91
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-220 4.5W H=.5" BLK
More Detail: Heat Sink TO-220 Aluminum 4.0W @ 80°C Board Level
DataSheet: 530614B00000G datasheet530614B00000G Datasheet/PDF
Quantity: 8729
1 +: $ 0.82530
10 +: $ 0.78498
25 +: $ 0.76457
50 +: $ 0.74390
100 +: $ 0.70258
250 +: $ 0.66125
500 +: $ 0.61992
1000 +: $ 0.57859
5000 +: $ 0.55793
Stock 8729Can Ship Immediately
$ 0.91
Specifications
Length: 1.180" (29.97mm)
Width: 1.000" (25.40mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 16.70°C/W
Material: Aluminum
Material Finish: Black Anodized
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal transfer is a widely used technique in many industries, including the automotive, computer, and electronics fields. Heat-sinks are a key device in facilitating thermal transfer and ensuring the efficient use of energy. The 530614B00000G is one of the leading heat-sink products on the market today, offering a range of features that makes it adaptable to a variety of applications.

Generally speaking, a heat-sink is an enclosure that absorbs and dissipates heat generated by other components in the system. The 530614B00000G is a heat sink made from aluminum and designed for applications involving high-temperature environments, with a maximum operating temperature of 200°C. It features a versatile design that allows for cooling of various components, including the CPU and memory. The enclosed aluminum surface is highly effective at conducting heat away from hot surfaces.

The 530614B00000G application field is wide-ranging, as it can be used in a variety of industrial procedures, such as soldering, welding and heat-treatment. It is also widely implemented in consumer electronics, including laptops, tablets and games consoles. As a result of its high thermal conductivity, the device is capable of dissipating heat quickly and efficiently. This makes the 530614B00000G ideal for applications where high heat is generated, such as 3D printing and audio/video production.

The working principle behind the 530614B00000G is based on the concept of conduction and convection. The heat is conducted away from the component or device into the heat-sink enclosure. Heat then dissipates from the enclosure using convection, where air is drawn away from the surface by a fan or ventilation system.

The 530614B00000G has been designed to attract high levels of heat and transfer it away from vital components. Heat is quickly conducted away from the surface of the component via the enclosure, reducing the chances of overheating and damage. The convection system then draws heat away from the surface, resulting in improved cooling performance and improved energy efficiency.

This device is ideal for a variety of different applications, thanks to its highly efficient thermal transfer capabilities. Its versatile design and reliable performance make it an attractive option for a variety of industrial and consumer processes. The 530614B00000G is a reliable and efficient heat-sink that is certain to provide the superior cooling capabilities necessary in a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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