Allicdata Part #: | 529901B02500G-ND |
Manufacturer Part#: |
529901B02500G |
Price: | $ 1.25 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEATSINK TO-218 SOLDER PIN |
More Detail: | Heat Sink TO-218 Aluminum 12.0W @ 50°C Board Level... |
DataSheet: | 529901B02500G Datasheet/PDF |
Quantity: | 1145 |
1 +: | $ 1.14030 |
10 +: | $ 1.08108 |
25 +: | $ 1.05235 |
50 +: | $ 1.02400 |
100 +: | $ 0.96711 |
250 +: | $ 0.91022 |
500 +: | $ 0.85334 |
1000 +: | $ 0.79645 |
5000 +: | $ 0.76801 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-218 |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 1.650" (41.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | 12.0W @ 50°C |
Thermal Resistance @ Forced Air Flow: | 1.00°C/W @ 800 LFM |
Thermal Resistance @ Natural: | 4.50°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management technology has become increasingly important in today\'s high-tech world. Heat sinks are integral components in almost any electronic device and, therefore, even the smallest thermal management requirements can have a big impact on the performance of a device. The 529901B02500G heat sink is a product of extensive research and development. It is specifically designed to meet the thermal management requirements of a wide variety of applications, and its unique working principle makes it an ideal choice for many thermal management systems.
The 529901B02500G heat sink consists of three main components: a heat-dissipating element, a thermal sensor, and a cooling fan. The heat-dissipating element is typically made of a copper-based material that is designed to quickly and efficiently dissipate heat away from the device. The thermal sensor is used to measure the temperature of the device and the cooling fan is used to circulate air around the heat sink, ensuring optimum thermal distribution throughout the device.
The 529901B02500G heat sink is designed to be used in a wide range of applications, but it is particularly well-suited to applications involving high-powered devices or components. In these applications, the 529901B02500G heat sink is able to dissipate heat more quickly and efficiently than many other heat sinks on the market, resulting in significantly improved performance. Additionally, the cooling fan provides an extra layer of protection, ensuring that the device remains cool even under the most extreme conditions.
The 529901B02500G heat sink\'s unique working principle is what allows it to be so effective. The heat-dissipating element is arranged in a series of fins, which act as heat conduits. As air is circulated around the fins, the heat is dissipated as the air passes over them. The thermal sensor constantly monitors the temperature of the device, and the cooling fan is used to keep the air circulating. This allows the device to remain reliably cool, even under the most extreme conditions.
In addition to its excellent heat dissipation capabilities, the 529901B02500G heat sink is also designed to be extremely durable and long-lasting. Its robust construction ensures that it is capable of withstanding the rigours of continued use in a variety of applications. Furthermore, its lightweight and compact design makes it easy to install and use in even the tightest of spaces, making it an ideal choice for many thermal management systems.
The 529901B02500G heat sink is an excellent solution for a wide range of thermal management needs. Its unique working principle and robust construction make it an ideal choice for applications requiring efficient heat dissipation, and its lightweight and compact design make it easy to install and use in virtually any environment. By making use of the 529901B02500G heat sink, electronic makers and users alike are able to rest assured that their devices will remain reliably cool, regardless of the conditions.
The specific data is subject to PDF, and the above content is for reference
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