| Allicdata Part #: | ATS35461-ND |
| Manufacturer Part#: |
ATS-21F-52-C2-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21F-52-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.54060 |
| 10 +: | $ 3.44736 |
| 25 +: | $ 3.35437 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is an electronic device used to dissipate excess heat generated from a device into the surrounding atmosphere. As the heat generated by electronic devices increases, an effective thermal management solution becomes increasingly important. The ATS-21F-52-C2-R0 is a thermal heat sink from Advanced Thermal Solutions, Inc., which is specifically designed to dissipate and manage heat generated from electronic components and assemblies.
The ATS-21F-52-C2-R0 is well-suited for a variety of applications. It can be used in a variety of consumer electronics, such as laptop computers, set-top boxes, and gaming consoles. It is also suitable for industrial applications such as cooling of industrial automation control systems, motion control units, and communication systems. The heat sink is designed to dissipate heat generated from CPUs, GPUs, APUs, and other components that produce a lot of heat.
The ATS-21F-52-C2-R0 has a stack-finned aluminum construction, with a total height of 57.2mm and a 63mm x 63mm mounting area. It is designed to be easy to install, with a screw-mounting system and intuitive mounting hardware. It is also designed to work in a variety of orientation positions, so it can be installed in relatively tight spaces.
The ATS-21F-52-C2-R0 thermal heat sink also includes a fan. The fan has a speed range of 500 to 3,200 RPM, and is designed to allow for a range of airflow adjustment. It operates quietly, helping to reduce the noise levels in surrounding areas. The fan is also designed to provide protection against dust and electrostatic shock.
In terms of performance, the ATS-21F-52-C2-R0 is designed to maintain a safe operating temperature range, even when running at full capacity. This allows components to operate at maximum efficiency, while prolonging their life span. The heat sink also features an internal thermal interface system which is designed to evenly transfer heat away from the component, while also providing better contact between the component and the heat sink.
The ATS-21F-52-C2-R0 provides an excellent solution for managing heat generated in electronic components and assemblies. It is designed to be easy to install and use, and is well-suited for a variety of applications. It effectively dissipates heat and helps to maintain a safe operating temperature range, extending the life of electronic components while also improving performance.
The specific data is subject to PDF, and the above content is for reference