ATS-12A-176-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS20158-ND

Manufacturer Part#:

ATS-12A-176-C2-R0

Price: $ 4.03
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X15MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12A-176-C2-R0 datasheetATS-12A-176-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.66030
10 +: $ 3.56265
25 +: $ 3.36470
50 +: $ 3.16676
100 +: $ 2.96881
250 +: $ 2.77089
500 +: $ 2.57297
1000 +: $ 2.52349
Stock 1000Can Ship Immediately
$ 4.03
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.59°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-12A-176-C2-R0 Thermal - Heat Sinks Application Field and Working Principle

Thermal - heat sinks are an integral part of the cooling process used in electronics, especially in the high-power electronic devices used in communication, data storage, and medical applications. Heat sinks are devices that absorb and dissipate heat generated by electronic components. They are designed to maximize the rate of thermal energy transfer between the component they are cooling and their environment. A heat sink is usually made up of two separate components: a heat spreader and a fin stack. The primary purpose of the fin stack is to increase the surface area of the heat sink, allowing heat to spread out more evenly over its total area, improving dissipation. The heat spreader increases the contact area between the heat sink and the component being cooled. The fin stack is typically constructed of aluminum or copper, and the heat spreader is usually made of a thermally conductive material such as copper, aluminum, or stainless steel.

The ATS-12A-176-C2-R0 thermal - heat sink is a metallic heat sink, made from an aluminum with machined fins, designed to lower the temperature of components in medium to high power applications. The machined fins on the ATS-12A-176-C2-R0 heat sink provide an increase in surface area for heat dissipation, allowing it to dissipate more heat than other conventional heat sinks. The ATS-12A-176-C2-R0 also takes up less space than traditional heat sinks, making it ideal for systems where space is at a premium. The device is typically designed to be mounted onto a printed circuit board (PCB), and it is placed directly near the component to be cooled in order to maximize the rate of heat dissipation.

The working principle of any thermal - heat sink is the same, regardless of its size or design. Heat is generated from an electronic component, such as a power amplifier or processor, and then transferred to the heat sink and spread over its entire surface. This quickly dissipates the heat into the atmosphere. Heat sinks also work in conjunction with other cooling components, such as fans, water cooling systems, and other cooling measures.

The ATS-12A-176-C2-R0 thermal - heat sink, in particular, has a number of unique features that make it ideal for a variety of applications. The device is designed with extended fins, which provides better heat dissipation, even with a smaller package. The increased surface area also reduces air resistance and noise, making it suitable for applications where noise sensitivity is a concern. The ATS-12A-176-C2-R0 also comes with a simple installation kit that makes it easy to mount and install.

The ATS-12A-176-C2-R0 thermal - heat sink is an ideal solution for any application that requires efficient and reliable heat dissipation. Its extended fins and simple installation make it suitable for medical, communication, and data storage applications, where space and noise are both priorities. The ATS-12A-176-C2-R0 heat sink ensures that heat is dissipated quickly and efficiently, so that the components it is cooling remain safe and functioning optimally.

The specific data is subject to PDF, and the above content is for reference

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