Allicdata Part #: | ATS-14D-82-C1-R0-ND |
Manufacturer Part#: |
ATS-14D-82-C1-R0 |
Price: | $ 3.42 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X25MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-14D-82-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.10275 |
30 +: | $ 3.01896 |
50 +: | $ 2.85125 |
100 +: | $ 2.68349 |
250 +: | $ 2.51579 |
500 +: | $ 2.43193 |
1000 +: | $ 2.18034 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.74°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal management technology has become an increasingly important part of modern electronics design. For many years, heat sinks have been used to dissipate heat generated by electronic components. One of the most commonly used heat sink designs is the ATS-14D-82-C1-R0, which has an application field and working principle that make it an effective heat-dissipating device.
The ATS-14D-82-C1-R0 is designed for direct attachment to printed circuit boards. This heat sink is constructed of aluminum with a black anodized, powder-coated outer finish that provides excellent thermal transfer. The heat sink is designed to regulate component temperature so that it does not exceed a predetermined value. By dissipating the excess heat, it prevents component damage and prolongs the life of the components.
The ATS-14D-82-C1-R0 works on the principle of conduction. Heat is conducted away from the component through the surface of the heat sink, which acts as a heat sink to absorb the heat and disperse it into the surrounding environment. This process is facilitated by the heat transfer coefficient of the heat sink\'s surface, which determines how quickly the heat is conducted away from the component. The higher the heat transfer coefficient, the faster the heat is dissipated.
In terms of application field, the ATS-14D-82-C1-R0 is suitable for power LEDs and power modules, power amplifiers, voltage regulators, and other power-segmentation circuits. It is also suitable for low-power processors or other high-dissipation components. Its surface mountable design makes it suitable for use in combination with LED lighting modules and other high-density components.
The ATS-14D-82-C1-R0 is available in several sizes and is designed to fit the specific thermal requirements of each application. It is also highly customizable, and can be configured to suit the requirements of the particular application. Its compact design makes it an effective and efficient option for thermal management.
The ATS-14D-82-C1-R0 is a reliable and easy to use solution for dissipating heat generated by electronic components. Its application field and working principle make it an effective thermal-management tool, allowing it to be used in a wide variety of applications. It is a cost-effective and reliable solution that is suitable for most application types.
The specific data is subject to PDF, and the above content is for reference