| Allicdata Part #: | ATS-15C-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-15C-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15C-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an integral part of any electronics application, and one of the most widely used methods is the application of heat sinks. Heat sinks are devices designed to transfer heat away from an electronic component or system and dissipate it into the surrounding environment, keeping the component or system at an acceptable operating temperature. The ATS-15C-173-C1-R0 thermal management heat sink is designed to do just that.
The ATS-15C-173-C1-R0 heat sink is specifically designed for use in high-power electronics applications, such as power amplifiers and motor drives. It is constructed of high-quality aluminum and features a serrated fin to maximize surface area and fully dissipate heat, even at high temperatures. The ATS-15C-173-C1-R0 features a large round base of 1.93” which provides maximum mounting stability, and includes a baffle plate to reduce air turbulence.
The ATS-15C-173-C1-R0 heat sink is also designed with an optimized thermal interface between the heat sink and the component or system. It features a flexible interface layer, which is a heat- and pressure-conductive elastomer that fills irregularities between the heat sink and the component being cooled. This provides a large contact area and ensures that the desired temperature is achieved quickly.
The ATS-15C-173-C1-R0 is designed to reduce temperature of the component or system being cooled efficiently and effectively. The aluminum construction provides excellent thermal conductivity, while the optimized thermal interface increases the heat transfer rate. This ensures that the desired temperature is achieved in the shortest time possible. Additionally, the large base and baffle plate design reduce air turbulence and further improve thermal performance.
The ATS-15C-173-C1-R0 heat sink is a reliable and efficient thermal management solution for high-power electronics applications. It’s aluminum construction and optimized thermal interface provide excellent heat transfer rates while its large base and baffle plate design reduce air turbulence. This ensures that the desired temperature is achieved quickly and reliably. For these reasons, the ATS-15C-173-C1-R0 is well-suited for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference