| Allicdata Part #: | ATS-05F-128-C1-R0-ND |
| Manufacturer Part#: |
ATS-05F-128-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-128-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05F-128-C1-R0 is a thermal heat sink, which is used in a wide array of applications. It is designed to increase the efficiency and heat dissipation for devices such as CPUs, GPUs, LEDs, RAMs and other high frequency components. By dissipating heat away from these components, the device can maintain stable temperature and operation, decreasing the amount of voltage needed to deliver the same output and increasing overall device life. Additionally, the ATS-05F-128-C1-R0 thermal heat sink also helps reduce energy loss caused by large temperature fluctuation and current leakage.
The ATS-05F-128-C1-R0 heat sink is a reliable, lightweight aluminium heat sink that is designed for quick and easy installation. It features a unique finned design that effectively maximizes the surface area, allowing a greater air-flow and maximum heat dissipation performance. The heat sink incorporates a built-in pinned base technology, which allows the user to quickly and easily adjust the air flow rate between the fins and the heat sink body. This allows the user to fine tune the heat sink’s performance to suit different application requirements.
In terms of its working principle, the ATS-05F-128-C1-R0 thermal heat sink is designed to transfer thermal energy from the components to surrounding air. This is done by a simple process known as convection - the primary mode of heat transfer between surfaces in contact with one another. The air surrounding the heat sink is heated up when it comes into contact with the hot components, causing the heat to flow away from the components and around them. This heat is then gradually dissipated away from the device through the heat sink, allowing the components to remain cooler and more stable.
The ATS-05F-128-C1-R0 thermal heat sink is often used in small personal electronic devices such as laptops, cell phones, and tablets. Additionally, it can be used in coin mining machines and data centers. In these scenarios, the ATS-05F-128-C1-R0 heat sink helps disperse the heat, allowing the components to run cooler and extending their lifespans, while increasing the efficiency of the system as a whole.
The ATS-05F-128-C1-R0 thermal heat sink is a invaluable tool for maintaining optimal temperature and energy efficiency in many applications. Its lightweight and easy-to-install design allows it to be quickly set up and used in a variety of settings. Additionally, its versatile design and adjustable fins allow the user to fine-tune it to match their needs, achieving optimal efficiency and performance every time.
The specific data is subject to PDF, and the above content is for reference