ATS-06G-53-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06G-53-C1-R0-ND

Manufacturer Part#:

ATS-06G-53-C1-R0

Price: $ 3.79
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06G-53-C1-R0 datasheetATS-06G-53-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.44736
30 +: $ 3.35433
50 +: $ 3.16802
100 +: $ 2.98166
250 +: $ 2.79531
500 +: $ 2.70213
1000 +: $ 2.42260
Stock 1000Can Ship Immediately
$ 3.79
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become a key challenge for many industries, from data centers to medical equipment. Heat sinks, specifically the ATS-06G-53-C1-R0, are one of the most popular products in this application field. They are designed to maintain temperatures in a safe range, preventing damage to expensive electronics and other sensitive components.

A heat sink is essentially a chunk of metal or other material designed to help dissipate heat away from the originating component. The ATS-06G-53-C1-R0 is a high-performance heat sink designed for heavy-duty applications. It features a 6”x53” aluminum fin structure that allows it to quickly dissipate heat away from the source. The anodized finish increases the heat-dissipating surface area, creating a more efficient cooling system.

The ATS-06G-53-C1-R0 works by employing a combination of conduction and convection. The surface area of the heat sink is designed to contact liquid or air to help dissipate heat away from its source. As the air or liquid comes into contact with the heat sink, the heat is drawn away from the source and dissipated away.

The ATS-06G-53-C1-R0 also features a high quality thermal transfer compound that helps to promote heat transfer from the source to the heat sink. This compound is designed to maximize the thermal transfer between the source and the sink, ensuring that the heat is rapidly dissipated. The surface of the heat sink is also designed to reduce turbulence as well as air pockets, allowing for better heat transfer.

The ATS-06G-53-C1-R0 heat sink is designed to be used in any application that requires thermal management. It is ideal for regulating temperature in data centers, medical equipment, industrial control systems, and computers. Additionally, it can be used to control environmental factors such as wind chill, humidity, and air temperature.

The ATS-06G-53-C1-R0 heat sink is a high-performance product that is designed to provide superior thermal management. Its combination of conduction and convection helps to rapidly dissipate heat away from the source, keeping temperatures in a safe range. Its anodized finish increases the surface area for even greater cooling efficiency. The thermal transfer compound facilitates rapid heat transfer to the sink, ensuring the best possible cooling performance. The ATS-06G-53-C1-R0 is the ideal product for any application that requires superior thermal management.

The specific data is subject to PDF, and the above content is for reference

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