ATS-04E-186-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.77°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-04E-186-C1-R0 Thermal - Heat Sink is a device designed for heat dissipation from electronic components. It is a very popular type of thermal solution used in many applications, especially those involving high-power components, such as CPUs and high-end graphics cards. The ATS-04E-186-C1-R0 heatsink is especially suited for applications requiring low temperature, highly reliable cooling. In this article, we will discuss the application field and working principle of the ATS-04E-186-C1-R0 Thermal - Heat Sink. Application Field

The ATS-04E-186-C1-R0 Thermal - Heat Sink is suitable for high power applications, where airflow is not an issue. It is ideal for high power LED’s, laser diodes, power transistors, and integrated circuits. The heatsink features a low thermal resistance of 0.25℃/W, which is very low compared to other types of heatsinks. The product is made of high-grade aluminum with a black coating that provides excellent corrosion resistance, and also has excellent heat transfer properties. The heatsink also features a ribbed design for increased convective heat dissipation, which helps ensure efficient cooling in the most demanding thermal applications. Working Principle

The ATS-04E-186-C1-R0 Thermal - Heat Sink works on a simple principle – convective heat dissipation. This works by transferring heat away from the component and into the air. The fins of the heatsink are designed to protrude into the air, creating a greater surface area for heat to dissipate more efficiently. The increased surface area helps to reduce the temperature of the component, helping it to remain cooler and remain stable during operation. The heatsink is also designed with large gaps between the fins, to allow increased air flow, which further aids in the heat dissipation process. Conclusion

The ATS-04E-186-C1-R0 Thermal - Heat Sink is an ideal choice for applications requiring low temperature, highly reliable cooling. It features a low thermal resistance of 0.25℃/W, and is made of high-grade aluminum with a black coating for corrosion resistance. The product also features a ribbed design for increased convective heat dissipation. It works on the principle of convective heat dissipation, which involves transferring heat away from the component and into the air. The increased surface area of the heatsink helps to reduce the temperature of the component, allowing it to remain cool and stable during operation.

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