| Allicdata Part #: | ATS-P2-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-P2-14-C1-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-P2-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks have been used in a variety of computing applications for decades. The ATS-P2-14-C1-R0 (ATS-P2-14-C1-R0) heat sink is one such device, designed to help regulate the temperature of electronics in a range of applications. This article looks at what applications this heat sink is suited to and its operating principles.
Applications
ATS-P2-14-C1-R0 heat sinks are designed for use in applications that require a high level of temperature control. Common applications involving ATS-P2-14-C1-R0 heat sinks include:
- PCI and PCI-X Motherboards
- Graphics Cards
- Industrial Control Systems
- Power Supplies
- Telecommunications Equipment
- Televisions
Due to the nature of these applications, the ATS-P2-14-C1-R0 heat sink is designed to be highly durable and reliable. The design of the heat sink is also optimized to ensure that it can effectively regulate the temperature of its components.
Working Principle
The ATS-P2-14-C1-R0 heat sink works according to the principle of heat conduction. Heat is generated by the components within the device, and the heat sink works to absorb this heat and dissipate it away from the heat source. This is done through the use of a series of fins, whichencourage air flow around the heat source. This helps to draw the heat away from the heat source, while providing additional cooling to ensure that the temperature remains regulated.
The ATS-P2-14-C1-R0 heat sink also uses a copper base plate to increase the speed at which heat is conducted away from the heat source. This helps to increase the cooling efficiency of the heat sink, allowing for better temperature control.
Conclusion
The ATS-P2-14-C1-R0 heat sink is designed for use in applications that require high levels of temperature control. It functions by utilizing principles of heat conduction, drawing heat away from its components and dissipating it through a series of fins and a copper base plate. It offers highly reliable temperature regulation, making it well suited to applications such as PCI and PCI-X motherboards, graphics cards, industrial control systems, power supplies, and telecommunications equipment.
The specific data is subject to PDF, and the above content is for reference