| Allicdata Part #: | ATS-10B-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-10B-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are devices designed to provide efficient thermal coupling between two components while reducing the rate of temperature increase in the components. The ATS-10B-60-C1-R0 heat sink is especially designed to improve the performance and life span of high power electronics. It works by efficiently transferring excess heat away from electronic devices using a high level of thermal conductivity and dissipating it into the ambient air.
The ATS-10B-60-C1-R0 heat sink is designed for use in most high power electronics applications. It has a robust design which includes extruded aluminum fins, machined from bar stock aluminum, silicon rubber gaskets, and 3 steel mounting brackets to secure it to the electronic device. The fins increase the surface area for air-cooling, while the gaskets seal the heat sink in place. The fins are spaced to allow air to pass between them, providing maximum cooling performance. The heat sink has an overall size of 60 inches wide, 10 inches high, and 1.5 inches thick.
The working principle of the ATS-10B-60-C1-R0 heat sink is based on the concept of heat conduction. Heat is generated by the electronic device and spread across the surface of the heat sink through thermal conduction. The fins then disperse the heat into the air, carrying it away from the electronic device. Cooler air is then driven up through the fins, providing more efficient heat transfer away from the component and reducing its temperature.
The application of ATS-10B-60-C1-R0 heat sink can be found in a variety of electronic systems, including but not limited to computer motherboards, power transmission and distribution systems, aerospace systems, industrial instrumentation, and motor control systems. It is also suitable for use in medical and consumer products, where cooling efficiency is important for optimizing performance or increasing lifespan of the system.
The ATS-10B-60-C1-R0 heat sink is a highly efficient thermal solution capacble of improving the performance and lifespan of various high power electronics. Its effective and reliable design helps to transfer heat away from components and reduce their sustained temperature. This makes it the ideal choice for a wide range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference