| Allicdata Part #: | ATS-11C-102-C3-R0-ND |
| Manufacturer Part#: |
ATS-11C-102-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-102-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions can provide the engine for successful applications in a variety of uses. The ATS-11C-102-C3-R0 is a thermal-heat sink designed to provide superior cooling to computer system components and other embedded electronics.
The ATS-11C-102-C3-R0 heat sink is a low-profile, compact and lightweight solution to a variety of thermal challenges. It is made from aluminum alloy with a die-cast zinc-alloy frame that helps provide reliable cooling. The heat-sink fins are designed so that they can be used for either traditional fan-based cooling systems, or for clamshell-type systems in which the fins are encased in a protective housing.
Designed for superior thermal performance, the ATS-11C-102-C3-R0 is built to handle a wide range of temperatures from -40°C to +150°C (-40°F to +302°F). It is designed to meet the requirements of high-end server applications, providing extremely efficient cooling when high performance is a necessity.
The working principle of the ATS-11C-102-C3-R0 heat sink is based on the thermodynamics of cooling. Heat is generated from the components within the system, and this heat has to be dissipated somehow in order to keep the components at a temperature that does not cause damage to them. The heat generated is transferred from the component to the heat sink, where it is dissipated in one of two ways. The first is through direct radiation, in which the heat is allowed to transfer to the surrounding environment through the fins on the heat sink. The second is through convection, in which the heat is transferred from the component to the heat sink and then away from the system through fans or other cooling elements.
The ATS-11C-102-C3-R0 thermal-heat sink is capable of dissipating up to 3W of heat, making it suitable for a variety of applications. The heat sink is also compatible with a variety of CPUs, including Intel, AMD, VIA, and many others. It can be used in a variety of applications, including server, workstation and multimedia applications.
The ATS-11C-102-C3-R0 heat sink is the perfect solution for applications that require efficient cooling. It is easy to install, and highly reliable and efficient. It is a great way to ensure that components are kept at the optimal temperature for maximum performance.
The specific data is subject to PDF, and the above content is for reference