Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

ATS-08H-33-C2-R0 application field and working principle

Heat sinks are widely used in many electronics and gadgets. This article will discuss the application field and working principle of ATS-08H-33-C2-R0 thermal heat sink in particular.Heat sinks are devices used to dissipate heat generated by an electric component. They are typically made of metal, but may also be made of other materials such as plastic or ceramics. Heat sinks are important components in the electronics industry, as they are critical for maintaining device reliability and performance.The ATS-08H-33-C2-R0 thermal heat sink is a high-performance device designed for high-power dissipation applications. It features a high thermal conductivity aluminum or copper construction and features an array of high-density copper pins for a more efficient thermal transfer. The heat sink has a ribbed design to increase the surface area for better heat dissipation and an advanced four-colors digital temperature sensing system for improved temperature monitoring. It also has mounting holes for easy installation.The working principle of the ATS-08H-33-C2-R0 thermal heat sink is based on the idea of thermal conduction, which means transferring heat from one point to another. Heat generated by an electric component can be transferred from the hot spot of the component to the thermal heat sink by means of conduction. The thermal heat sink then dissipates the heat away from the component by passing it onto the air around it.The ATS-08H-33-C2-R0 thermal heat sink is widely used in many applications, such as consumer electronics, automobiles and industrial machinery. It is very effective for dissipating heat from components that generate a lot of heat, such as high-power LEDs, circuit boards, transistors, processors, and other electronic components.In conclusion, the ATS-08H-33-C2-R0 thermal heat sink is a highly-efficient device and is capable of handling high power dissipation. Its advanced four-colors digital temperature sensing system and ribbed design for increased surface area makes it perfect for applications that require high heat dissipation. It is widely used in many different industries and can be used to effectively cool electronic components.

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