QB0402A20ESTD Allicdata Electronics
Allicdata Part #:

QB0402A20ESTD-ND

Manufacturer Part#:

QB0402A20ESTD

Price: $ 0.65
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For 0402 Package
DataSheet: QB0402A20ESTD datasheetQB0402A20ESTD Datasheet/PDF
Quantity: 1000
1000 +: $ 0.58464
Stock 1000Can Ship Immediately
$ 0.65
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
For Use With/Related Products: 0402 Package
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Thermal management is essential to ensure the optimal performance and safety of any electronics or electronic systems. The presence of heat sinks placed in proximity to thermal sources that generate heat is the most efficient way to dissipate it. Heat sinks generally consist of a body, which contacts the source, and a fin structure, which is engineered to provide maximum surface area in order to dissipate the heat. The QB0402A20ESTD is an advanced heat sink with state-of-the-art technologies and capabilities. Its application field and operating principles will be the focus of this article.

Design

The architect of the QB0402A20ESTD Heat Sink is optimized to provide unparalleled thermal performance, consisting of an extruded aluminum body and fin structure. The finned aluminum body is precisely designed to have ample surface area and optimized fin geometry allowing for maximum heat dissipation and maximum air flow. The fins are also optimized to achieve the highest possible thermal transfer with its air-cooling solution.

Application Field

The application field of the QB0402A20ESTD Heat Sink includes a variety of thermal management applications, such as temperature control, system cooling, and device cooling. It is ideal for use in combination with current generation of processor/chipset devices; used to dissipate the heat generated from the device\'s electrical components and maintain an optimal operating temperature. This ensures the device continues to perform efficiently and remain stable. The Heat Sink is also suitable for use in small, enclosed spaces, such as devices with extreme space constraints.

Working Principle

The QB0402A20ESTD Heat Sink uses air-cooling as its thermal management solution. The aluminum fin-and-body structure is designed to maximize surface area, which allows for greater contact with the air, producing greater heat dissipation. The fin geometry is optimized to ensure the highest degree of thermal transfer possible by optimizing surface area and the natural convection of air around the fins.

The Heat Sink\'s thermal performance is further enhanced with the use of "active cooling". The fan draws in outside air, which is then forced through the fins of the Heat Sink. This increases the rate of heat dissipation, which increases performance, and consequently cooling performance. In essence, this allows the Heat Sink to respond to the heat-generating needs of the system or device, ensuring greater thermal performance and stability.

Conclusion

The QB0402A20ESTD Heat Sink is an advanced thermal management solution, designed to provide optimal performance and safety in extreme environmental conditions. Its aluminum body and fin structure are optimized to provide maximum surface area to dissipate heat efficiently, while the fan, which enables "active cooling", further enhances the Heat Sink\'s thermal performance. As a result, the Heat Sink is suitable for a variety of thermal management applications, such as temperature control, system cooling, and device cooling, and is ideal for use with current generation of processor/chipset devices.

The specific data is subject to PDF, and the above content is for reference

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