Allicdata Part #: | 529901B00000-ND |
Manufacturer Part#: |
529901B00000 |
Price: | $ 0.76 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink TO-218 Aluminum 6.0W @ 30°C Board Level |
DataSheet: | 529901B00000 Datasheet/PDF |
Quantity: | 1000 |
4000 +: | $ 0.68531 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-218 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 1.650" (41.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | 6.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 1.00°C/W @ 800 LFM |
Thermal Resistance @ Natural: | 4.50°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important factor for any electrical system, as it can affect performance and even cause system failure. Heat sinks are designed to dissipate heat from electrical components and reduce the internal temperature of the system, thereby improving performance and reliability. The 529901B00000 is a thermal management component designed for thermal management of high-power components. The 529901B00000 thermal management application field and working principle will be discussed in the following text.
The 529901B00000 is a thermal heat sink, which has a low thermal impedance, meaning it dissipates heat quickly and efficiently. Its optimized design contains diamond-shaped pin fins, which allows a larger amount of heat to be dissipated from the system. Additionally, the 529901B00000 is constructed from lightweight aluminum, making it easy to mount and highly durable. The 529901B00000 is suitable for a wide range of applications in the telecommunications, automotive and manufacturing industries, including FETs, chipsets, and optical module processors. It is ideal for densely packed systems, such as those found in multi-core processors.
In order to dissipate heat from the device, the 529901B00000 uses a process called conduction. Conduction is the transfer of heat through physical contact between two objects. In this case, the heat generated by the electronic components is transferred through the heat sink into the surrounding air. The pin fins on the heat sink act to increase the surface area, allowing the heat to dissipate more quickly. Furthermore, the diamond-shaped design of the pin fins also provides an efficient path for airflow, allowing the heat to dissipate more efficiently.
The 529901B00000 is also designed to provide optimal thermal conductivity. This is achieved by a combination of materials used in its construction, along with an optimized design featuring diamond-shaped pin fins. The diamond-shaped pin fins act as a heat spreader, allowing the heat to be dissipated more evenly and efficiently across the entire surface of the heat sink. Additionally, the lightweight aluminum used in its construction allows the heat sink to be lightweight and easily mounted in a variety of applications.
The 529901B00000 is also designed to provide excellent cooling performance. This is achieved by its optimized design, which features diamond-shaped pin fins. The diamond-shaped pin fins act to increase the surface area, allowing the heat to dissipate more quickly. Additionally, the design of the pin fins also provides an efficient path for airflow, allowing the heat to dissipate more efficiently. Furthermore, the lightweight aluminum used in its construction allows the heat sink to be lightweight and easily mounted in a variety of applications.
Furthermore, the 529901B00000 is rated at a maximum temperature of 95°C, which is suitable for many applications. The heat sink also features an internal thermal protection circuit, which helps to protect the component from damage caused by excessive heat. This provides an added level of protection and ensures that the electronic components are safely operating at their optimal temperature.
In summary, the 529901B00000 is a thermal heat sink designed for thermal management of high-power components. It offers excellent cooling performance, low thermal impedance, and optimal thermal conductivity. It is suitable for a wide range of applications in the telecommunications, automotive and manufacturing industries, and is ideal for densely packed systems, such as those found in multi-core processors. Furthermore, it features an internal thermal protection circuit and is rated for a maximum temperature of 95°C, making it a reliable and reliable thermal management component.
The specific data is subject to PDF, and the above content is for reference
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