529902B00000 Allicdata Electronics
Allicdata Part #:

529902B00000-ND

Manufacturer Part#:

529902B00000

Price: $ 0.77
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-220 Aluminum 6.0W @ 30°C Board Level
DataSheet: 529902B00000 datasheet529902B00000 Datasheet/PDF
Quantity: 1000
4000 +: $ 0.69149
Stock 1000Can Ship Immediately
$ 0.77
Specifications
Thermal Resistance @ Natural: 4.50°C/W
Material: Aluminum
Material Finish: Black Anodized
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Width: 1.650" (41.91mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 500 LFM
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are an integral component of a wide range of electronic devices. They are used to dissipate heat, maintain temperature stability and protect electronic circuits. The 529902B00000 thermal heat sink is a unique device designed to provide maximum heat transfer performance for a variety of applications.

The 529902B00000 thermal heat sink is cylindrical in shape and is made of anodized aluminum. It features an extended surface area that provides excellent heat dissipation. It also features internal dimples, which increase the surface area and promote better air circulation. This allows for more efficient thermal regulation, extending the life of the device and the connected electronic components.

The 529902B00000 thermal heat sink also features a special anti-static coating. This improves the static dissipative properties of the device, protecting sensitive electronic components from shock, vibration and electrostatic discharge.

The 529902B00000 thermal heat sink is suitable for a wide range of applications, including electronic enclosures, medical equipment, power supplies, computer cooling systems, and more. It is designed to be compatible with various thermal management components, including heat spreaders, cold plates, and other cooling elements. The device also meets UL and CSA standards for safety and performance.

The maximum working temperature for the 529902B00000 thermal heat sink is 150°C. The device has a thermal resistance of 0.4°C/W, a thermal conductivity of 1.00 W/mK, and a thermal impedance of 33 mK/W. The device is designed to effectively dissipate heat from various components, providing optimal thermal regulation and extended reliability.

The 529902B00000 thermal heat sink offers superior performance and reliability. This device is ideal for a variety of applications, including medical, aerospace, military, and industrial applications. It is designed to dissipate heat efficiently and protect connected components from failure due to excessive heat.

The specific data is subject to PDF, and the above content is for reference

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