QB1005A40WYC7

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are used in many types of electronic components in order to dissipate heat generated by the component, ensuring the longevity of the application by preventing component failure. The QB1005A40WYC7 (QB1005A40WYC7) is a commonly used heat-dissipating component, which is often used in applications with higher power needs.

The QB1005A40WYC7 is a type of thermal-heat sink that is designed for high-current applications. It has a copper-finned aluminum body, with a thermal resistance of 0.2°C/W and a thermal resistance of 0.1°C/W in still air. Its dimensions are 48 x 49.5 x 28 mm and it weighs only 5.2 g.

The QB1005A40WYC7 operates based on the principles of thermodynamics. Its design allows it to efficiently transfer the heat from the component being cooled, to the copper fin material, and then to the surrounding air. This process is referred to as convection. The higher the rate of convection, the more efficient the heat-transfer process.

The QB1005A40WYC7 is usually used in applications where space is at a premium, or where a component requires larger amounts of power. It is also suitable for applications that require moderate to high-currents, or where a thermal load may be heavier than usual. Examples of such applications include; electronic power sources, CPUs, HVAC, and medical equipment.

In summary, the QB1005A40WYC7 thermal-heat sink is a high-performance, efficient heat-dissipating component that is suitable for a variety of high-power applications. Its copper-finned aluminum construction is lightweight and effective in dissipating heat compared to other types of heat-dissipating components.

The specific data is subject to PDF, and the above content is for reference