QB0402A20ESC7 Allicdata Electronics
Allicdata Part #:

QB0402A20ESC7-ND

Manufacturer Part#:

QB0402A20ESC7

Price: $ 2.09
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For 0402 Package
DataSheet: QB0402A20ESC7 datasheetQB0402A20ESC7 Datasheet/PDF
Quantity: 1000
100 +: $ 1.88559
Stock 1000Can Ship Immediately
$ 2.09
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
For Use With/Related Products: 0402 Package
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are important components in today’s technology and electrical engineering. They are used to help dissipate the heat from electrical circuits, usually those running in high-power or intensive computing applications. The QB0402A20ESC7 is a type of thermal heat sink that is designed to provide increased cooling performance in many situations. In this article, we\'ll discuss the application field and working principle of the device.

Application Field

The QB0402A20ESC7 is most often used in application areas that require high levels of power consumption. This includes, but is not limited to, computers, servers, data centers, and other high-end electronic systems. These systems usually require increased levels of cooling due to their power needs, and the QB0402A20ESC7 is designed to provide that cooling. In addition to these areas, it can also be used in many other electronics applications where heat dissipating solutions are needed.

Working Principle

The QB0402A20ESC7 works on the principle of natural convection. This means that as the ambient temperature rises around the heat sink, air is drawn into the fins of the heat sink, carrying with it waste heat from the electrical component or system that is placed on top of the heat sink. This rising air then exits from the other side of the heat sink as cooler air, providing the necessary cooling effect. The cooling effect can be further amplified by providing additional airflow around the heat sink, such as through a fan, thereby improving the heat transfer from the component to the outside environment.

The QB0402A20ESC7 also utilizes its unique fin design to further improve heat dissipation. By using angled fins with multiple interlocking layers, the heat sink is able to squeeeze more air into its surface area, whilst also providing a greater surface area for air to exit. The result is an increased cooling effect with minimal airflow required.

Conclusion

The QB0402A20ESC7 is a thermal heat sink that provides increased cooling performance for applications that require high levels of power. It uses the natural convection principle to draw in warm air from around the component and exit cooler air, whilst also using a unique fin design to amplify this effect. As a result, this heat sink is ideal for high end electronics applications that require advanced cooling solutions.

The specific data is subject to PDF, and the above content is for reference

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