QB1111B40ESTD Allicdata Electronics
Allicdata Part #:

QB1111B40ESTD-ND

Manufacturer Part#:

QB1111B40ESTD

Price: $ 2.41
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB1111B40ESTD datasheetQB1111B40ESTD Datasheet/PDF
Quantity: 1000
1000 +: $ 2.16877
Stock 1000Can Ship Immediately
$ 2.41
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: QB1111B40ESTD Application Field and Working Principle Thermal locking, also known as a heat sink, is an essential component in any modern electronics system. It is designed to transfer heat away from sensitive electronic components that require a controlled cooling environment. The QB1111B40ESTD is a component-level heat sink specifically designed to solve thermal management problems in high temperature applications.In order to fully understand how the QB1111B40ESTD works, it is important to understand the basic idea of thermal locking. Thermal locking refers to the process of transferring heat away from its source. Heat is created by electrical components when they are operated, and this heat tends to accumulate on the surrounding components. Thermal locking is used to dissipate this heat by providing a layer of cooling material between the electronic components and the surrounding air.There are several advantages associated with the QB1111B40ESTD that make it suitable for high temperature applications. It can effectively manage heat up to 150°C, meaning that it can be safely used in consumer electronics, appliance, and vehicle applications. Additionally, the QB1111B40ESTD features five-pin RCA connector technology, which greatly improves thermal performance. This technology helps to quell voltage spikes, thereby helping to limit any damage due to thermal stress.The QB1111B40ESTD is also very efficient when it comes to thermal management. The RCA connector helps to ensure that all the necessary heat is removed from the area, and that no portions of the components are left exposed to dangerous levels of heat. Additionally, the component-level design helps to reduce the amount of airflow needed to effectively cool the system. As a result, the QB1111B40ESTD can be used in high density systems without sacrificing thermal performance.The QB1111B40ESTD can also be effectively used to cool electronics components in automotive applications. The component-level design helps to ensure that the heat will be efficiently dissipated and the flexible RCA connector ensures that the same thermal characteristics are maintained even as temperatures vary. Additionally, the heat sink has been designed to be waterproof, allowing it to provide protection even in wet or damp conditions.In conclusion, the QB1111B40ESTD is an effective solution for thermal management in high temperature applications. Its component-level design ensures that all necessary heat is removed from the area, and the innovative RCA connector helps to reduce the amount of flow needed for effective cooling. Additionally, its waterproof design allows it to be used in a variety of harsh environments.

The specific data is subject to PDF, and the above content is for reference

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