Allicdata Part #: | QB2010A60ESTB-ND |
Manufacturer Part#: |
QB2010A60ESTB |
Price: | $ 2.50 |
Product Category: | Fans, Thermal Management |
Manufacturer: | American Technical Ceramics |
Short Description: | THERMAL CONDUCTOR Q-BRIDGE |
More Detail: | Heat Director/Transfer For |
DataSheet: | QB2010A60ESTB Datasheet/PDF |
Quantity: | 1000 |
500 +: | $ 2.24847 |
Series: | Q-Bridge |
Part Status: | Active |
Accessory Type: | Heat Director/Transfer |
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QB2010A60E thermal-heat sink is a type of thermal management technology that is designed to efficiently dissipate and manage heat from any device, such as an electronic device, in an effective and efficient manner. It is typically used for temperature control in a variety of devices, such as computer systems, communication systems, and consumer electronics. The heat sink is made of aluminum, copper, silver, or other suitable heat-conductor materials and is designed to dissipate heat by releasing heat to a cooler environment instead of storing it within the device.
The thermal-heat sink consists of a set of fins or heat conduction plates that are exposed to the ambient air, and small passageways through which the air can move. As the heated air passes through the passageways, it is cooled down by the fins or heat conduction plates. This heat conduction is usually assisted by a fan or other cooling mechanism. The thermal-heat sink is usually used as part of the thermal control system of electronic devices, as it is designed to dissipate heat from places where it can cause damage to the components of the device, such as the chip, base plate, or circuit board.
In addition to dissipating heat from the device, the QB2010A60E thermal-heat sink also functions as a heat exchanger, transferring heat away from the components and into the cooler environment. This helps to reduce the temperature of the device\'s components, which helps to improve their performance and reliability. The thermal-heat sink can be used to cool down a wide variety of devices, including CPUs, GPUs, motherboards, memory components, and power supplies. It can also be used to reduce the temperature of a variety of other devices, such as graphics cards and hard drives.
In order to dissipate heat efficiently, the QB2010A60E thermal-heat sink is typically designed with a high degree of conductivity. This helps to ensure that heat is dissipated quickly and efficiently, rather than simply being stored and reradiated from the device. In addition, the thermal-heat sink is usually designed with a high degree of surface area to maximize the amount of air that is exposed to the fins or heat transfer plates. This helps to improve the efficiency of the thermal control system, as the more air that is moving through the device, the cooler the device\'s temperature will be.
QB2010A60E thermal-heat sink is designed to work in conjunction with a cooling fan in order to reduce the temperature of the device\'s components. By increasing the speed of the fan, more air is circulated through the fins or heat transfer plates, which helps to reduce the temperature of the components. The thermal-heat sink can also be combined with other cooling technologies, such as water cooling, in order to further reduce temperature and protect the components from overheating.
Overall, the QB2010A60E thermal-heat sink is an effective and efficient heat dissipation and management system that is designed to help reduce the temperature of a variety of devices. It is a reliable and cost-effective solution that can be used to ensure that the components of a device are not damaged by overheating. In addition, the thermal-heat sink can also be used to improve the performance and life expectancy of a device.
The specific data is subject to PDF, and the above content is for reference
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