Allicdata Part #: | 1168-1388-ND |
Manufacturer Part#: |
PH3-300-300-0.21-1A |
Price: | $ 42.43 |
Product Category: | Fans, Thermal Management |
Manufacturer: | t-Global Technology |
Short Description: | IR HEAT SPREADER/EMITTER W/ADH |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper... |
DataSheet: | PH3-300-300-0.21-1A Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 38.19060 |
Series: | PH3 |
Part Status: | Active |
Type: | Heat Spreader |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Adhesive |
Shape: | Square |
Length: | 11.811" (300.00mm) |
Width: | 11.811" (300.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.008" (0.21mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Copper |
Material Finish: | Polyester |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are a critical component of many electronic products, and PH3-300-300-0.21-1A is one of the most commonly used thermal heat sinks in the market today. This heat sink utilizes a unique combination of materials and design to successfully transfer heat generated by electronic components away from the device. In this way, PH3-300-300-0.21-1A helps to ensure that electronic devices operate at optimal temperatures and reduce the risk of overheating and component failure. The following is an overview of the application field and working principle of the PH3-300-300-0.21-1A thermal heat sink.
PH3-300-300-0.21-1A thermal heat sink is an ideal choice for many electronics applications. It is used mainly in computers, telecommunications equipment, and consumer electronic appliances. This heat sink is constructed of all-aluminum construction with an internal core made of highly efficient, thermally-conductive material. This core serves to effectively dissipate any heat generated from the components in the device, helping to reduce operating temperatures and the potential for overheating. This heat sink is also highly effective in resisting corrosion, vibration, and other environmental factors, making it a suitable choice for long-term projects.
The working principle of the PH3-300-300-0.21-1A thermal heat sink is based on the process of heat dissipation. Heat is created by electrical components when they are in operation and this heat must be efficiently dissipated in order to prevent overheating. To accomplish this, the heat sink is designed with an open core that allows for the transfer of heat between the component and the metal base of the sink. The metal base of the heat sink is also designed with a series of fins which further aid in the process of heat transfer. The heat generated by the component is absorbed by the heat sink, which then dissipates the heat away from the device and into the surrounding air.
The PH3-300-300-0.21-1A thermal heat sink is a reliable and efficient way of transferring heat away from electronics. By utilizing the metal base and finned design, this heat sink is able to effectively dissipate the heat generated by electronic components and help to ensure that your devices operate at optimal temperatures and reduce the risk of overheating and component failure. This heat sink is also designed to resist corrosion, vibration, and other environmental factors, making it an ideal choice for long-term projects. Additionally, due to its versatile design and lightweight construction, the PH3-300-300-0.21-1A is an excellent choice for a variety of electronics applications.
The specific data is subject to PDF, and the above content is for reference