B30B-XADSS-N Allicdata Electronics
Allicdata Part #:

B30B-XADSS-N-ND

Manufacturer Part#:

B30B-XADSS-N

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: JST Sales America Inc.
Short Description: CONN HDR XAD 30POS 2.5MM TIN TE
More Detail: Connector Header Through Hole 30 position 0.098" (...
DataSheet: B30B-XADSS-N datasheetB30B-XADSS-N Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: XAD
Packaging: Bulk 
Part Status: Obsolete
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.098" (2.50mm)
Number of Positions: 30
Number of Rows: 2
Row Spacing - Mating: 0.098" (2.50mm)
Number of Positions Loaded: All
Style: Board to Cable/Wire
Shrouding: Shrouded - 4 Wall
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Locking Ramp
Contact Length - Mating: --
Contact Length - Post: 0.138" (3.50mm)
Overall Contact Length: --
Insulation Height: 0.398" (10.11mm)
Contact Shape: Circular
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: --
Contact Finish - Post: Tin-Lead
Contact Material: Copper Alloy
Insulation Material: Polyamide (PA66), Nylon 6/6, Glass Filled
Features: --
Operating Temperature: -25°C ~ 85°C
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Current Rating: 3A
Voltage Rating: 250V
Mated Stacking Heights: 13.8mm
Contact Finish Thickness - Post: --
Applications: --
Description

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B30B-XADSS-N Application Field and Working Principle

Rectangular Connectors - Headers, Male Pins, are typical electronic components used to connect two or more electrical circuits. The B30B-XADSS-N series of these components is a kind of vertical connecting device that can be mounted on the printed circuit board (PCB). The device has a top surface mounting orientation, and the pins are arranged in two rows with 30 pins per row.The B30B-XADSS-N series has great insulation and contact ability, and a wide variety of models with a variety of combinations of outer structures, contact regulations. Its basic structure consists of an insulating body, an insulating cover, a metal housing, a pin, and a packing spring. The insulating body is made of glass-fiber reinforced injection-molded thermoplastic resin, with rectangular shape, mountable on a PCB, and high temperature resistance. The insulating cover is composed of black components, with a metal housing placed on top, and its shape is consistent with that of insulating cover. The metal housing acts as a protection from dust, moisture and mechanical protection of the pin headers.The pins are arranged in two rows, with a spacing between their pins of 0.3mm on the B30B-XADSS-N series. The pins are made of 0.9mm diameter gold plated copper alloy, with a length of 3.5mm and a strong retention force between the contacts, making them suitable for high speed electrical signals. The packing spring keeps the pins securely in place, making them reliable and durable.In terms of application field, B30B-XADSS-N series of pin headers are widely used in fields such as industry, household appliances, digital products, medical equipment, automobiles and security systems. They are especially suitable for digital products with high requirements on anti-interference capability and transmission stability.The working principle of B30B-XADSS-N series of pin header is very simple. When the electrical current passes through the pin headers, it will push the contact of the pin and establish a connection, thus completing the connection circuit of two or more electrical circuits. By using the mechanical properties of the material and the electrical property of insulation and the principle of bridging, connecting and conducting, the current will pass through the entire pin header.In summary, the B30B-XADSS-N series of pin headers are widely used in the fields of industry, household appliances, digital products, medical equipment, automobiles and security systems, and its working principle is very simple. They are reliable, durable and can provide users with a reliable connection for high speed electrical signals.

The specific data is subject to PDF, and the above content is for reference

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