YFS-40-03-H-05-SB

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Application Field and Working Principle of YFS-40-03-H-05-SB

YFS-40-03-H-05-SB is a rectangular connector array edge type board to board system, designed for high-speed and robust connections in applications where size and weight constraints are important.

This system offers an ideal solution for applications which require connectivity between high-density boards or enclosures, with features which include: silver plated contacts, both vertical and horizontal PCB mounting, low profile designs, and space savings compared to other products.

Application Fields

YFS-40-03-H-05-SB can be used in a variety of applications, including digital imaging, automotive, drone control and communications, medical imaging, military, and aerospace. It is suitable for applications that require stiffening springs, greater suspension, larger board-to-board interconnects and heavier loading due to an improved current rating of up to 10A.

It can also be used in applications which require extreme vibration or shock, due to its robust design and reliable performance. Moreover, its low profile design and small package size make it suitable for applications which require a compact form factor. Additionally, its thermal protection feature ensures that electrical performance is maintained in harsh temperatures.

Working Principle

The YFS-40-03-H-05-SB system uses a modular design which can be adapted to fit your specific needs. It includes several key components, including:

• Connector - This includes one or more connectors, which are used to join or interconnect components.
• Contact - This includes arrays of pins, which are used to connect the two components. These contacts have a plated metal finish, which provides improved performance and durability.
• Connector Body - This is the housing that holds the components together.
• Backplane - This is a rigid substrate that connects the multiple boards together.

The design of the system allows for flexible signal distribution, which offers enhanced board-to-board performance. Additionally, it ensures accurate alignment of the connector body and contacts, which prevents signal degradation due to poor connection. Its silver plated contacts also allow for improved signal integrity, longer service life and superior reliability.

To ensure reliable connections, the system also features a low-insertion-force design which prevents contact damage. This is achieved by using an industry-standard design which has been optimized for high speeds and low contact resistance. This ensures that it is suitable for demanding environments and can withstand continuous operation.

In summary, the YFS-40-03-H-05-SB system is a robust, high-speed interconnect system, which is suitable for a variety of applications. Its features include an industry-standard design, silver-plated contacts, low profile design and small package size. Furthermore, its design ensures reliable and efficient connections, which can withstand harsh conditions.

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