ATS-PCB1018 Allicdata Electronics
Allicdata Part #:

ATS2060-ND

Manufacturer Part#:

ATS-PCB1018

Price: $ 0.27
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK TO-220 BLACK
More Detail: Heat Sink TO-220 Aluminum Board Level
DataSheet: ATS-PCB1018 datasheetATS-PCB1018 Datasheet/PDF
Quantity: 2227
1 +: $ 0.23940
10 +: $ 0.22932
25 +: $ 0.21773
50 +: $ 0.21193
100 +: $ 0.20903
250 +: $ 0.19472
500 +: $ 0.18325
1000 +: $ 0.16607
5000 +: $ 0.16035
Stock 2227Can Ship Immediately
$ 0.27
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 0.902" (22.90mm)
Width: 1.000" (25.40mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.80°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

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Introduction

Thermal - Heat Sinks are an essential part of various kinds of application. ATS-PCB1018 is a thermal compound composed of a mixture of soft thermal pads and conductive particles that are designed for use in a variety of system heat sink applications. This compound helps to reduce heat and protect system components from electrical shorts. The combination of an ATS-PCB1018 heat sink and thermal compound yields many benefits when used in applications requiring conduction of heat or electrical signals.

Application Field of ATS-PCB1018

The ATS-PCB1018 is a highly effective thermal compound for use in many applications. It can be used in various industries, such as electrical and electronics, automotive, aerospace, medical, and military. It can be used in various systems, such as embedded systems, PC boards, server boards, ASICs, GPUs, and other electronics. In addition, the ATS-PCB1018 can also be used with a heatsink in applications for high-temperature operation (up to 200°C), thermal management, and electrical insulation.ATS-PCB1018 can be used in a variety of applications, ranging from controlling the temperature of cooling systems to providing heat dissipation for electrical devices. In cooling systems, ATS-PCB1018 helps to reduce the heat generated from system components, which keeps temperatures operating at optimal levels. Additionally, when used in conjunction with a heatsink in electronics, it increases the efficiency of the system by allowing heat to be transferred away from the components and dissipated into the surrounding environment quicker. This helps to increase the system\'s overall performance and decrease the amount of electrical shorts and failures.

Working Principle of ATS-PCB1018

The ATS-PCB1018 is an innovative solution for thermal management. It works by using the heat generated from the system components and transforming it into heat that is then dispersed into the surrounding air. The ATS-PCB1018 consists of a special type of thermal pad that is composed of self-contained particles of conductive material. The thermal compound is then applied between the thermal pads and the device’s metal surface for the optimum thermal transfer.The ATS-PCB1018 thermal compound is incredibly easy to use and can help to reduce the amount of time taken to install a heat sink. Its design also allows it to be used in extremely thin applications, helping to further reduce the total system size.When using the ATS-PCB1018 in a heat sink, the thermal compound acts as a bridge between the heatsink and the device, helping to conduct heat away from the system components. The thermal compound also provides excellent electrical insulation, preventing short circuits. The thermal compound also helps to limit the amount of heat that is absorbed by the heat sink, thus ensuring that less energy is wasted in the system.

Conclusion

The ATS-PCB1018 thermal compound is a highly effective solution for thermal and electrical insulation applications. It provides superior thermal conduction, excellent electrical insulation, and a variety of other benefits when used in conjunction with a heatsink or cooling system. This heat sink thermal compound can help to reduce the size of the system and enable the system to operate more efficiently.

The specific data is subject to PDF, and the above content is for reference

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