0077001717 Allicdata Electronics

0077001717 RF/IF and RFID

Allicdata Part #:

0077001717-ND

Manufacturer Part#:

0077001717

Price: $ 0.32
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: SLMT,2F,SNB
More Detail: N/A
DataSheet: 0077001717 datasheet0077001717 Datasheet/PDF
Quantity: 1000
1000 +: $ 0.28995
Stock 1000Can Ship Immediately
$ 0.32
Specifications
Series: Slot Mount
Part Status: Active
Type: Fingerstock
Shape: --
Width: 0.320" (8.13mm)
Length: 0.356" (9.04mm)
Height: 0.110" (2.79mm)
Material: Beryllium Copper
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Attachment Method: Slot
Operating Temperature: 121°C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RFIs and EMI, Contacts, Fingerstock and Gaskets are used in a variety of applications. Examples of some of these applications include medical, communications, industrial, automotive, military, space, power management, and consumer applications. This article will focus on the application field and working principle of the 0077001717 product.

The 0077001717 product is designed for a wide range of electronic applications, including RF/microwave and high frequency EMI products. The EMI/RFI contact is used to prevent unintentional electromagnetic interference (EMI) or radio-frequency interference (RFI) between different electrical systems and components. It is also used to create a reliable electrical connection between two surfaces to provide RFI/EMI shielding.

The 0077001717 product is made of stainless steel and designed with an aggressive angled point edge to ensure maximum EMI/RFI protection. This is achieved by ensuring maximum pressure contact with minimal contact area. It also features a flared shape to easily fit various size panels. The contact is also pre-formed with a press-fit system that increases installation speed and accuracy. This method prevents contact corrosion, ensures a secure connection, and optimizes the system’s performance.

The 0077001717 product features a grounding design that allows for robust EMI/RFI solutions. Grounding the contact creates increased levels of ground coplanarity and RF shielding effectiveness. The contact is also designed with multiple points of contact to ensure this effectiveness and prevent unintentional EMI/RFI from entering or exiting the system. Additionally, the contact is made with a beryllium copper contact pad, which has a higher electrical conductivity than other materials, thus reducing the need for wire forms.

The 0077001717 product can be used with different materials, such as plastics and metals, to provide reliable EMI/RFI prevention. The product is primarily used with plastic enclosures, cabinets, and backplanes, but can also be used with aluminum, copper, and other metals. This product is highly customizable and can be designed and manufactured to the specific requirements of the application.

The 0077001717 product also features an integrated gasket, which is designed to provide additional EMI/RFI protection, as well as improved environmental sealing. The gasket is engineered with a spring-loaded design that ensures an optimal gasket compression and provides a reliable solution for complex environment sealing and EMI/RFI needs.

Overall, the 0077001717 product is an ideal solution for applications that require reliable EMI/RFI protection and environmental sealing. Its aggressive angled point edge and flared shape ensure maximum pressure and minimal contact area while its beryllium copper contact pad ensures increased electrical conductivity. Its integrated gasket further helps to ensure EMI/RFI shielding effectiveness and optimize system performance. With its easy installation and robust design, the 0077001717 product is the ideal choice for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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