| Allicdata Part #: | 06-3513-11H-ND |
| Manufacturer Part#: |
06-3513-11H |
| Price: | $ 1.55 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Aries Electronics |
| Short Description: | CONN IC DIP SOCKET 6POS GOLD |
| More Detail: | N/A |
| DataSheet: |  06-3513-11H Datasheet/PDF |
| Quantity: | 1000 |
| 60 +: | $ 1.41120 |
| Series: | Lo-PRO®file, 513 |
| Packaging: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 6 (2 x 3) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -- |
| Termination Post Length: | 0.125" (3.18mm) |
| Material Flammability Rating: | UL94 V-0 |
| Current Rating: | 3A |
| Contact Resistance: | -- |
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Sockets for ICs, Transistors
The 06-3513-11H socket is a versatile industrial socket suitable for a variety of applications, including embedded electronics, industrial networking, and telecommunications. It is made up of two modules, an outer housing and a contact-level element. The socket enables a connection between an integrated circuit or transistor die and a mother board. This ensures that the delicate components are not exposed to the harsh conditions of the environment.
The outer housing offers protection against physical damage such as dust, moisture, and other contaminants. It is precision-machined to ensure a flush fit between the device and board. The contact-level element consists of a compliant spring layer and a cup-shaped wire connector. These elements are designed to ensure a secure connection between the processor and the board. The contact-level element is constructed from high-grade chemistry metals that provide superior electrical conductivity.
In operation, the socket uses its compliant spring layer and cup-shaped wire connectors to make electrical contact with the pins of the processor. As the processor heats up during operation, the compliant spring layer compressed slightly which adapts the contact resistance to the reduced connector size. This ensures an optimal electrical connection with minimal crosstalk and signal loss. The socket also takes advantage of the cup-shaped wire connector which reduces the pin-to-pin contact distance and increases the electrical connection solidity.
The 06-3513-11H socket is ideal for embedded electronics applications where high-speed data transfer is necessary. It is also suitable for communications applications such as Ethernet, USB, and Serial bus. Moreover, the socket is RoHS compliant and is compatible with most common ICs and transistors.
The specific data is subject to PDF, and the above content is for reference
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