10113949-M0E-30DLF

The 10113949-M0E-30DLF is a low-profile interconnect system designed and manufactured by Amphenol ICM. It is primarily used as a backplane interconnect in applications where a robust, reliable and long life connection is vital.

The connector features a 6-pin male contact configuration. It is compatible with 8 mm pitch boards, 60P+ density, and rated up to 20A gross current. It is designed to meet the highest level of requirements for EMI, vibration, and temperature, making it ideal for use in harsh environment applications.

The 10113949-M0E-30DLF is designed to provide reliable connections between boards and backplanes in high-performance applications such as data and telecommunications equipment, instrumentation, and medical equipment. It is available in two different variants – one with a low-profile design and another with a standard-height design.

The 10113949-M0E-30DLF offers a high performance connection between boards and backplanes. It is designed to provide reliable mechanical interconnects in a wide range of industries and applications. The connector features a robust design with self-compensating shrouded contacts, and a housing design that provides 360° shielding against EMI. It is designed to provide accurate and secure connections, and is capable of providing up to 25 Amps peak current when used in conjunction with the compatible active boards.

The 10113949-M0E-30DLF is designed to meet the highest level of requirements for vibration, temperature, and EMI, and is suitable for use in military and aerospace applications, as well as in a wide range of commercial products. It is capable of withstanding severe shock and vibration conditions, making it suitable for use in harsh environments.

The working principle of the 10113949-M0E-30DLF is based on the molex-style design. The system includes a housing, two contact pins, and a secondary pin. The pins are made of high-quality materials, for reliable performance and long life. The pins are designed to provide secure mechanical connections between boards and backplanes. When engaged, the male contacts of the connector are inserted into the female contact cavities of the housing. This connection is secured by a unique locking system, which is engaged automatically when the connection is made.

In summary, the 10113949-M0E-30DLF is a low-profile interconnect system primarily used as backplane interconnects. It features a 6-pin male contact configuration and is designed to provide reliable mechanical connections in a wide range of applications. It is rated to carry up to 20A gross current and is suitable for use in extreme temperature, vibration, and EMI environments. Furthermore, the connector is also designed to engage with a unique locking system to provide a secure connection.