116-83-428-41-011101 Allicdata Electronics
Allicdata Part #:

116-83-428-41-011101-ND

Manufacturer Part#:

116-83-428-41-011101

Price: $ 2.72
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: CONN IC DIP SOCKET 28POS GOLD
More Detail: N/A
DataSheet: 116-83-428-41-011101 datasheet116-83-428-41-011101 Datasheet/PDF
Quantity: 1000
135 +: $ 2.47725
Stock 1000Can Ship Immediately
$ 2.72
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 116
Features: Elevated, Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.4" (10.16mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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Socketing for ICs (Integrated Circuits) and transistors is rapidly becoming practice in the electronics industry due to the unprecedented growth of the technology. Socketing is the attaching of a socket to a circuit board by soldering the socket pins or by press-fitting the socket in place. Commonly referred to as "inserting" in the industry, socketing these components has become a very efficient, cost-effective, and reliable way of connecting many different components.

The most common application of socketing in the electronics industry is for ICs and transistors. This allows the connected components to be replaced or adjusted, often without the need for any additional hardware. This means that the entire assembly can be replaced or modified as needed, without needing to replace all of the connected components. This makes socketing a great choice for applications that need to be constantly updated or replaced.

When it comes to the working principles of socketing for ICs and transistors, it is important to understand the basics. Socketing occurs when a socket is attached to a circuit board by soldering the socket pins or by press-fitting the socket in place. Once this is done, connections between connected components can be made. These connections are usually made via electrical trace lines, which are soldered into place and typically follow predefined patterns.

The most commonly used socketing connection technique is referred to as “smt” or “surface mount technology”. This is an established technique that has been in use for many years, and it involves the application of solder paste to the electrical contact points of the connected components. This creates a secure, durable connection between the components. Smt socketing is a relatively simple process, which has made it the most commonly used socketing solution in the electronics industry.

When socketing for ICs and transistors, it is important to take all of the necessary precautions. Socketing should be carefully planned and executed in order to ensure maximum reliability and performance. The correct trace lines should be used, and care must be taken to ensure that all of the pins are correctly aligned. Otherwise, the connections between components may not be reliable. Finally, the temperature of the surrounding environment should be considered, as too much heat can damage the components or interfere with the performance of the circuit.

In conclusion, socketing for ICs and transistors is quickly becoming a preferred method of making connections in the electronics industry. It is an efficient, cost-effective, and reliable way of making the necessary connections. Socketing involves attaching a socket to a circuit board by soldering the socket pins or by press-fitting the socket in place. It is most commonly used in conjunction with surface mount technology, which involves the application of solder paste to the electrical contact points of the connected components. When socketing, it is important to plan and execute correctly in order to ensure reliable performance and avoid damage to the components.

The specific data is subject to PDF, and the above content is for reference

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