2266950-2

2266950-2, or commonly known as CSP (contact substrate placement/pressing) is a cutting-edge technology in the field of crimpers, applicators, and presses. It is particularly designed to provide superior contact placement and pressing capabilities, as well as reduce the cost and total process time. This technology is made up of two components: a contact substrate placement unit (the driver) and an electro-mechanical force (the actuator).The contact substrate placement unit is designed to move the contact substrate material into place on the substrate. It is responsible for controlling the accuracy of placement and the force required for contact formation. It uses a programmable logic controller (PLC) and a servo-driven actuator to adjust the position of the contact substrate, thereby controlling the placement of the contact and the force required for contact formation. The electro-mechanical force component operates in combination with the contact substrate placement unit. It is designed to apply a constant pressure directly to the contact substrate, ensuring that the contact is properly bonded with the substrate. The force is controlled by sensors located in the contact substrate and the actuator. This constant precise force allows for improved electrical connection and contact formation in a shorter period of time.The combination of the contact substrate placement unit and the electro-mechanical force component allow for improved contact placement and pressing capabilities as they apply uniformly distributed force, allowing for precise contact placement even in adverse conditions. Additionally, CSP technology is able to reduce the total process time and cost associated with contact formation, as the process is more efficient and easier to control.Overall, CSP technology provides superior contact formation and pressing capabilities for crimpers, applicators, and presses. It applies a controlled and more precise force resulting in improved electrical connection and contact formation in a shorter amount of time, while also reducing process costs and total process time.