581002B00000 Allicdata Electronics
Allicdata Part #:

HS300-ND

Manufacturer Part#:

581002B00000

Price: $ 0.92
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-220 4.3W H=1.0 BLK
More Detail: Heat Sink TO-220 Aluminum 2.5W @ 50°C Board Level
DataSheet: 581002B00000 datasheet581002B00000 Datasheet/PDF
Quantity: 7549
1 +: $ 0.83160
10 +: $ 0.79002
25 +: $ 0.76936
50 +: $ 0.74844
100 +: $ 0.70686
250 +: $ 0.66528
500 +: $ 0.62370
1000 +: $ 0.58212
5000 +: $ 0.56133
Stock 7549Can Ship Immediately
$ 0.92
Specifications
Part Status: Active
Type: Board Level
Package Cooled: TO-220
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 1.000" (25.40mm)
Width: 0.640" (16.26mm)
Diameter: --
Height Off Base (Height of Fin): 0.640" (16.26mm)
Power Dissipation @ Temperature Rise: 2.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 500 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Series: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The 581002B00000 heat sink is a type of thermal management tool used to dissipate heat away from various components and subsystems. This is achieved by increasing the surface area and/or improving airflow over the component or system. This heat sink model has multiple uses in various application fields.

Uses in Automotive Applications

In automotive applications, the 581002B00000 heat sink is typically used to cool engine components or battery packs. When used as a cooling device, the heat sink increases surface area and air flow, allowing for better heat dissipation and an overall cooling effect. In larger engines or in electric and hybrid vehicles, the thermal effects of several heat sinks can be further improved by adding a cooling fan or using a fused assembly of both. Additionally, these can be used to help cool the battery pack which houses the electrical components of an electric or hybrid vehicle.

Uses in Aerospace Applications

The principality of aircraft and spacecraft requires thermal management solutions that are lighter and more efficient. The 581002B00000 heat sink is a great solution for spacecraft, in particular, because of its lightweight construction and efficient cooling abilities. It is used to help dissipate heat caused by high speeds and friction from re-entry into the atmosphere. Additionally, it helps cool small computer components, electrical systems and other aerospace technology installed on board spacecraft, helping maintain optimum performance even in extreme conditions.

Uses in Robotic Applications

Robots are increasingly being used in a variety of applications, from cooking and cleaning to industrial and medical applications. Robots rely on electrical systems and components to operate, and like any electronic component, they generate heat. The 581002B00000 heat sink helps reduce internal temperatures, allowing robots to operate more smoothly and efficiently. Additionally, it helps to preserve the components and their lifespans by cooling them and protecting them from damage due to excessive heat.

Uses in Industrial Applications

Industrial applications often require a great deal of thermal energy management, and the 581002B00000 heat sink is a great solution for a variety of industrial scenarios. It can be used to cool processors and other electronics components in factories and warehouses, allowing for greater efficiency and greater accuracy. Additionally, it can be used to help cool hydraulic or pneumatic systems, or for temperature control applications.

Working Principle of a Heat Sink

The 581002B00000 heat sink is designed with multiple heat dissipating fins which extend outward from its base. The thermal conductivity of the material used for the fins is important, as it is responsible for transferring the heat from the device to the environment. The larger surface area of the fins, combined with good thermal conductivity, allows heat from the device or component to dissipate into the air. Additionally, the heat sink often has a layer of thermal compound applied to the base and the device being cooled for better heat transfer.

The specific data is subject to PDF, and the above content is for reference

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