Allicdata Part #: | HS371-ND |
Manufacturer Part#: |
591302B02800G |
Price: | $ 0.48 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEATSINK TO-220 W/INSTALL TAB |
More Detail: | Heat Sink TO-220, TO-262 Aluminum 1.0W @ 30°C Boar... |
DataSheet: | 591302B02800G Datasheet/PDF |
Quantity: | 2663 |
1 +: | $ 0.43470 |
10 +: | $ 0.41454 |
25 +: | $ 0.39388 |
50 +: | $ 0.38342 |
100 +: | $ 0.37825 |
250 +: | $ 0.35237 |
500 +: | $ 0.33163 |
1000 +: | $ 0.30054 |
5000 +: | $ 0.29018 |
Series: | -- |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-220, TO-262 |
Attachment Method: | Clip and Board Locks |
Shape: | Rectangular, Fins |
Length: | 0.750" (19.05mm) |
Width: | 0.500" (12.70mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | 1.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 7.00°C/W @ 400 LFM |
Thermal Resistance @ Natural: | 26.80°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks
A 591302B02800G heat sink is an application device used to transfer heat away from electronic components and into the air. It is a common part found in computers, servers, and other electronics.
The 591302B02800G heat sink is composed of metal fins arranged in a way to absorb and dissipate heat generated by an electronic component. The heat sink has a thermally conductive base that can be soldered or attached to the component. It is then connected with a heatpipe, which transfers the heat from the component to the fins. Heat pipes are often referred to as heat exchangers as they act as bridges between the component and the selected heat sink.
The job of the 591302B02800G heat sink is to absorb and spread heat out to the air. It helps keep components cool and maintain their temperature levels. It also assists in protecting them from overheating and potential damage.
The 591302B02800G heat sink is used in a wide variety of applications, such as industrial, automotive, agriculture, and aerospace. It is most widely used in computers, servers, laptops, and other high-performance computing equipment. It is also used in smartphones, tablets, wearables, and other mobile devices to keep their internal components cool.
The working principle of the 591302B02800G heat sink is simple. Heat is generated by the integrated circuit and transferred to the heat pipe. The heat pipe transports the heat to the fins on the heat sink and dissipates it into the air. The fan is responsible for moving air over the fins to help remove the heat and keep the component cool.
The 591302B02800G heat sink is a simple and effective method to dissipate heat away from sensitive electronic components. It is an important component in any cooling system, and its performance is essential in ensuring the longevity and reliability of electronic components.
The specific data is subject to PDF, and the above content is for reference
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