688552F00000G Allicdata Electronics
Allicdata Part #:

HS512-ND

Manufacturer Part#:

688552F00000G

Price: $ 66.33
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: 68855 EXTRUSION 0.46X7.201"X4'
More Detail: Heat Sink Aluminum Top Mount
DataSheet: 688552F00000G datasheet688552F00000G Datasheet/PDF
Quantity: 16
1 +: $ 60.30360
10 +: $ 56.53180
25 +: $ 52.76300
50 +: $ 50.87870
100 +: $ 48.99420
Stock 16Can Ship Immediately
$ 66.33
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: --
Attachment Method: Adhesive
Shape: Rectangular
Length: 48.000" (1219.20mm)
Width: 7.200" (182.88mm)
Diameter: --
Height Off Base (Height of Fin): 0.460" (11.68mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 0.50°C/W @ 500 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are devices used to transfer the heat generated by an electronic component or system into the surrounding environment. Heat sinks typically have metal fins, installed onto a base plate, and are usually made of materials such as aluminum or copper.

The 688552F00000G heat sink is one of the many models available on the market which is designed to absorb and dissipate the heat generated by various electronic components. Made of aluminum, the 688552F00000G heat sink features a base plate with an array of metal fins connected to it. These fins help to increase the surface area which is exposed to the surrounding air, and enhance the dissipation of heat generated by the connected components.

The increased surface area of the 688552F00000G heat sink also increases heat conduction and convection, allowing for maximum heat transfer away from the component and into the environment. This greatly reduces the risk of overheating and reduces the importance of additional cooling components.

The 688552F00000G heat sink is most suitable for use with components such as CPUs, GPUs, and I/O ports, that generate a large amount of heat over a short period of operation. The fin density of the 688552F00000G heat sink, and its large surface area, helps to reduce the overall temperature of these components faster and more efficiently compared to standard flat heat sinks, which is essential if the components are located in an environment with low ambient temperature.

In terms of installation, the 688552F00000G heat sink is easy to attach to compatible components using bolts and screws. A thermal paste or pad is then applied between the component and the heat sink to help improve the heat exchange process. In addition, the 688552F00000G heat sink also features holes in the base plate, allowing for noise reduction when attached to fan-cooled components.

Overall, the 688552F00000G heat sink is an ideal choice for space-constrained environments where cooling a large number of components quickly and efficiently is a top priority. It is also one of the more cost effective solutions on the market, making it an ideal choice for those looking to save money when cooling their electronic components.

The specific data is subject to PDF, and the above content is for reference

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