768161560GPTR13

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Resistor Networks, Arrays

The 768161560GPTR13 is an integrated circuit manufactured by SBOX which is used in Resistor Network/Array applications. It is a single-chip bipolar junction transistor (BJT)-based MOSFET network, which combines both BJTs into a single package with a single source of voltage and current. This IC offers maximum flexibility in terms of design, providing users with the ability to customize the chip to meet specific application requirements.

The 768161560GPTR13 IC works by controlling the flow of charge between its two BJT input and output transistors. It has a source voltage of 30V and a source current of 3A, enabling it to produce the needed current and voltage required for different applications. It also has an internal bias current of 3mA which provides the necessary bias current for BJT input transistors.

The 768161560GPTR13 IC is used in different array applications where significant circuitminiaturization is required. Its compact size and easy integration make it a perfect choice for creating complex networks such as resistor networks. The IC also offers higher packing density, meaning that more projects can be packed into the same area of the same board. The IC can also be used as part of a complete system, such as a microcontroller-based system.

As for its basic working principle, the 768161560GPTR13 IC uses its BJT input and output transistors to control the current flowing through its own resistor network. When a resistor is connected to the input and output terminals of the IC, a voltage is applied across the terminals. This voltage can be used to find resistance values in the circuit or to control a current source of a given value. Similarly, a constant current source applied at the input may control the output voltage and provides a way to program a wide range of voltage outputs.

Overall, the 768161560GPTR13 IC is a compact, customizable solution for resistor network application field. It can be used to create highly efficient and highly miniaturized arrays, and it offers users the ability to customize its features to meet their specific application requirements. Furthermore, it provides a high packing density, meaning more projects and components can be integrated into the same area of the same board.

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