AER55-55-21CB/A01

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Thermal management solutions are essential across a wide range of applications. Heat sinks are a key part of many effective thermal management solutions since they provide increased heat dissipation through their larger surface area and improved air flow around the component that generates the heat. The AER55-55-21CB/A01 is one of the most advanced heat sinks on the market and it provides a reliable and efficient thermal management solutions for a variety of applications.

The AER55-55-21CB/A01 heat sink is a double-sided thermal spreader that uses a combination of thermal conduction and air-flow convection to transfer heat away from components that generate heat. The thermal spreader is made of a highly conductive aluminum material and it features a total of 55 thermal enhancement fins to promote increased air-flow and cooling performance. The fins are spaced closely together to maximize air-flow and provide superior thermal dissipation in tight spaces. The double-sided design also helps to maximize air-flow by promoting the circulation of air within the heat sink.

AER55-55-21CB/A01 heat sink can be used in a variety of applications including medical electronics, consumer electronics, automotive electronics, and gaming electronics. It is ideal for applications that require high thermal performance and small form factors. The heat sink is also well-suited for systems that generate high-temperature components such as ultra-high speed microprocessors and data storage devices. The heat sink is capable of dissipating heat from components with temperatures up to 140 degrees Celsius.

The AER55-55-21CB/A01 heat sink has been designed to be cost-effective and easy to use. It requires minimal effort to install and can be easily integrated into existing heat management systems. The heat sink is compatible with most common mounting interfaces such as flip-chip, pin grid array, and ball grid array applications. Additionally, the heat sink is RoHS compliant and recyclable, making it an environmentally-friendly option for thermal management solutions.

The AER55-55-21CB/A01 heat sink is an efficient and reliable thermal management solution for use in a variety of applications. It is designed to be easy to install and maintain, and it is capable of dissipating heat from components with temperatures up to 140 degrees Celsius. It is the perfect choice for systems that require high thermal performance and small form factors. With its cost-effectiveness and environmental-friendly properties, the AER55-55-21CB/A01 heat sink is an excellent choice for any thermal management application.

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