Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	1.205" (30.61mm)
Width:	1.205" (30.61mm)
Diameter:	--
Height Off Base (Height of Fin):	1.283" (32.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.33°C/W @ 200 LFM
Thermal Resistance @ Natural:	9.43°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Thermal - Heat Sinks: APR31-31-33CB/A01 Application Field and Working Principle

Heat sinks are used to dissipate heat from a device or system so that it operates at a comfortable temperature. This is a critical function in the electronics industry, where components are very sensitive to heat. Heat sinks are a common solution in this sector, providing a cost-effective way to maintain a desirable temperature range for the components. The APR31-31-33CB/A01 is a thermal management product from Advanced Thermal Solutions, Inc., designed specifically for this application. It is used in many aspects of electronics, from consumer items to medical devices. In this article, we’ll discuss the application field and working principle of the APR31-31-33CB/A01 heat sink.The APR31-31-33CB/A01 is a thermoelectric cooling component, and is designed to provide a large amount of heat dissipation over a wide area. It is designed to be compact while still providing a high level of heat dissipation. The APR31-31-33CB/A01 is specifically designed for use in confined spaces, such as in the inside of a laptop or other small case. It has a highly efficient design, and the company claims that it offers a greater level of performance than other products on the market.The APR31-31-33CB/A01 is constructed from two sheets of graphite, with the other sheet containing a thermoelectric material. The graphite sheet is thermally bonded to the other sheet, and a thin layer of thermally conductive material is placed between the two sheets. This is done to increase the thermal transfer rate between the two sheets. The thermal transfer rate can be adjusted with a simple control knob, which provides the user with great flexibility in tuning the rate of heat dissipation.The APR31-31-33CB/A01 is a Peltier cooler, meaning it uses the Peltier effect to transfer heat from one side of the device to the other. This is done by running an electric current through the two sheets of graphite, which creates a difference in temperature between them. The electric current produces a gradient in temperature across the two sheets, which can be used to move heat from one side of the device to the other.The APR31-31-33CB/A01 is designed to be used in a variety of applications, including computers, communications, medical applications, and home appliances. Due to its high heat dissipative capabilities, it can be used to effectively remove large amounts of heat from components. It is also well suited for use in thermal management systems, where it can provide cooling to multiple components at the same time.In summary, the APR31-31-33CB/A01 is a thermal management component designed specifically for heat transfer applications. It is constructed from two sheets of graphite, with the other sheet containing a thermoelectric material. It uses the Peltier effect to move heat from one side of the device to the other, and offers an adjustable thermal transfer rate. Its highly efficient design makes it ideal for use in small cases, communications, medical, and home appliances.

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