| Allicdata Part #: | ATS2949-ND |
| Manufacturer Part#: |
ATS-01B-191-C2-R0 |
| Price: | $ 4.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01B-191-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.44780 |
| 10 +: | $ 4.32621 |
| 25 +: | $ 4.08568 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an integral role in managing the performance of electronic systems. The ability to dissipate heat effectively and efficiently from individual components is essential. Heat sinks are one of the most common methods for storing and transferring thermal energy by providing a surface area that increases the contact area between the component and the surrounding air. ATS-01B-191-C2-R0 is an aluminum heat sink specifically designed for thermal management of electronic components. In this article, we\'ll take a closer look at the application field and working principle of the ATS-01B-191-C2-R0 heat sink.
Application Field
The ATS-01B-191-C2-R0 heat sink can be used in many different areas of electronic component thermal management. It is compatible with a wide array of components, including integrated circuits, semiconductors, LEDs, transistors, and other components that require heat dissipation. It is also compatible with a variety of materials including aluminum, copper, stainless steel, and brass.
The ATS-01B-191-C2-R0 can be used for cooling both low and high power components. It is suitable for use with both forced convection and natural convection systems. It is also suitable for use in both dry and wet environments. It can be used in a variety of applications, such as industrial, commercial, and residential systems.
Working Principle
The ATS-01B-191-C2-R0 heat sink operates on the principle of thermal conduction. This means that it transfers thermal energy from a hotter source (like a component) to a cooler sink (like the surrounding air). The thermal energy is transferred in the form of heat, and the heat is dissipated from the component to the surrounding air through the ATS-01B-191-C2-R0 heat sink.
The ATS-01B-191-C2-R0 heat sink is specifically designed to maximize the amount of surface area contact between the component and the surrounding air. This increased contact area allows for greater heat transfer efficiency. The heat sink is designed with a heat dissipation design that is optimized for a wide range of operating temperatures. This ensures that the component remains within its safe operating temperature range.
The ATS-01B-191-C2-R0 heat sink is also designed with an advanced heat dissipation design for enhanced heat transfer efficiency. This advanced design incorporates a series of ribs and fins to increase the total surface area of the heat sink, allowing for efficient dissipation of heat from the component. In addition, the fins further enhance the heat transfer efficiency by creating a natural air flow as the air passes over them.
Conclusion
The ATS-01B-191-C2-R0 heat sink is an excellent thermal management solution for a wide range of electronic components. Its advanced design ensures efficient heat transfer from the component to the surrounding air. It is suitable for use in both dry and wet environments, and it is compatible with a variety of materials. Its increased contact area between the component and the surrounding air allows for greater heat transfer efficiency, making it an ideal choice for managing the temperature of components.
The specific data is subject to PDF, and the above content is for reference