| Allicdata Part #: | ATS3065-ND |
| Manufacturer Part#: |
ATS-01C-117-C2-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-117-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.40830 |
| 10 +: | $ 3.31695 |
| 25 +: | $ 3.22711 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration for electronic devices. Heat sinks are designed to dissipate the heat generated during operation of these devices while keeping the device’s temperature in a safe operating range. There are many types of heat sinks designed for different applications, including those used in the ATS-01C-117-C2-R0.
The ATS-01C-117-C2-R0 is a high performance and reliable thermal management solution, designed for use in a wide range of materials and processes. The unit is designed for use in a wide range of applications, including: high processing speeds, high temperatures, IGBTs and power supply devices, aerospace, industrial, automotive, and medical applications.
The ATS-01C-117-C2-R0 features a broad range of heat sinks with a variety of size and shape options. It also features specialized designs to provide thermal management solutions for a wide range of materials and processes. The heat sinks are designed to provide maximum heat dissipation from a given area while keeping the device’s temperature in a safe operating range.
The ATS-01C-117-C2-R0 features a unique heat sink design that is constructed from a highly conductive metal substrate with a series of fins. This design provides an extremely efficient heat dissipation system for the device, allowing it to operate at its maximum performance. The fins are designed to dissipate heat evenly to ensure uniform temperatures throughout the device.
The ATS-01C-117-C2-R0 is also designed to minimize thermal shock due to sudden temperature changes. The heat sink fins provide uniform heat dissipation, reducing the risk of thermal shock. The heat sink also features a wide range of surface areas, ensuring maximum heat transfer and thermal regulation.
The ATS-01C-117-C2-R0 has been designed to provide optimal thermal management for a wide range of devices, including IGBTs, power supply, and high temperatures. The heat sink offers superior heat dissipation, even under the most demanding conditions. It also features a low thermal resistance design, allowing the device to remain at its optimal operating temperature.
The ATS-01C-117-C2-R0 also features a broad range of materials and configurations. It is available in both aluminum and copper, as well as a range of thicknesses and sizes. This allows the customer to choose a heat sink that is best suited for their specific application. This also ensures the device operates at its best performance and the best possible thermal management.
The ATS-01C-117-C2-R0 is designed to provide a reliable solution for all types of thermal management applications. It is designed to provide efficient heat dissipation, while keeping the device’s temperature in a safe operating range. The unit is also designed to provide maximum heat transfer and thermal regulation. This allows the device to remain at its optimal operating temperature, thus ensuring excellent performance and reliability.
The specific data is subject to PDF, and the above content is for reference